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SN74CBTD3384 具有电平转换功能的 10 位 FET 总线开关

The ’CBTD3384 devices provide ten bits of high-speed TTL-compatible bus switching. The low on-state resistance of the switches allows connections to be made without adding propagation delay. A diode to VCC is integrated on the die to allow for level shifting between 5-V inputs and 3.3-V outputs.

These devices are organized as two 5-bit switches with separate output-enable (OE\) inputs. When OE\ is low, the switch is on, and port A is connected to port B. When OE\ is high, the switch is open, and the high-impedance state exists between the two ports

SN74CBTD3384
ron(max)(ohms) 7
tpd max(ns) 0.25
Pin/Package 24SOIC
Technology Family CBT
Operating Temperature Range(°C) -40 to 85
Approx. Price (US$) 0.40 | 1ku
SN74CBTD3384 特性
SN74CBTD3384 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN74CBTD3384DW ACTIVE -40 to 85 0.37 | 1ku SOIC(DW) | 24 50 | TUBE  
SN74CBTD3384DWE4 ACTIVE -40 to 85 0.37 | 1ku SOIC(DW) | 24 50 | TUBE  
SN74CBTD3384DWG4 ACTIVE -40 to 85 0.37 | 1ku SOIC(DW) | 24 50 | TUBE  
SN74CBTD3384DWR ACTIVE -40 to 85 0.31 | 1ku SOIC(DW) | 24 2500 | LARGE T&R  
SN74CBTD3384DWRE4 ACTIVE -40 to 85 0.31 | 1ku SOIC(DW) | 24 2500 | LARGE T&R  
SN74CBTD3384DWRG4 ACTIVE -40 to 85 0.31 | 1ku SOIC(DW) | 24 2500 | LARGE T&R  
SN74CBTD3384 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN74CBTD3384DW Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTD3384DW SN74CBTD3384DW
SN74CBTD3384DWE4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTD3384DWE4 SN74CBTD3384DWE4
SN74CBTD3384DWG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTD3384DWG4 SN74CBTD3384DWG4
SN74CBTD3384DWR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTD3384DWR SN74CBTD3384DWR
SN74CBTD3384DWRE4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTD3384DWRE4 SN74CBTD3384DWRE4
SN74CBTD3384DWRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTD3384DWRG4 SN74CBTD3384DWRG4
SN74CBTD3384 应用技术支持与电子电路设计开发资源下载
  1. SN74CBTD3384 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器信号开关产品选型与价格 . xls
  3. Logic Guide 2009 (PDF 4263 KB)
  4. 防止模拟开关的额外功耗 (PDF 392 KB) (PDF 1305 KB)
  5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  9. Designing With Logic (PDF 186 KB)
  10. Live Insertion (PDF 150 KB)
  11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  14. LOGIC Pocket Data Book (PDF 6001 KB)
  15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  16. Logic Cross-Reference (PDF 2938 KB)