SN74CB3T16211 具有 5V 容限电平转换器的 20 位 FET 2.5V/3.3V 低电压总线开关

The SN74CB3T16211 is a high-speed TTL-compatible FET bus switch with low ON-state resistance (ron), allowing for minimal propagation delay. The device fully supports mixed-mode signal operation on all data I/O ports by providing voltage translation that tracks VCC. The SN74CB3T16211 supports systems using 5-V TTL, 3.3-V LVTTL, and 2.5-V CMOS switching standards, as well as user-defined switching levels (see Figure 1).

The I/O port of this device has a pullup current source that maintains the output voltage at VCC when the device is ON and the input is greater than or equal to VCC – 1. Because of the pullup current source, the output voltage level may be less than VCC when the operating frequency is low and the I/O port is connected to a pulldown resistor

	SN74CB3T16211
ron(max)(ohms)	9.5
tpd max(ns)	0.25
Pin/Package	56BGA MICROSTAR JUNIOR, 56SSOP, 56TSSOP, 56TVSOP
Technology Family	CB3T
Operating Temperature Range(°C)	-40 to 85
Approx. Price (US$)	2.10 | 1ku

SN74CB3T16211 特性

• Member of the Texas Instruments WidebusTM Family
• Output Voltage Translation Tracks VCC
• Supports Mixed-Mode Signal Operation On All Data I/O Ports
  • 5-V Input Down To 3.3-V Output Level Shift With 3.3-V VCC
  • 5-V/3.3-V Input Down To 2.5-V Output Level Shift With 2.5-V VCC
• 5-V Tolerant I/Os With Device Powered-Up or Powered-Down
• Bidirectional Data Flow, With Near-Zero Propagation Delay
• Low ON-State Resistance (ron) Characteristics (ron = 5 Typical)
• Low Input/Output Capacitance Minimizes Loading (Cio(OFF) = 5 pF Typical)
• Data and Control Inputs Provide Undershoot Clamp Diodes
• Low Power Consumption (ICC = 70 uA Max)
• VCC Operating Range From 2.3 V to 3.6 V
• Data I/Os Support 0 to 5-V Signaling Levels (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
• Control Inputs Can be Driven by TTL or 5-V/3.3-V CMOS Outputs
• Ioff Supports Partial-Power-Down Mode Operation
• Latch-Up Performance Exceeds 250 mA Per JESD 17
• ESD Performance Tested Per JESD 22
  • 2000-V Human-Body Model (A114-B, Class II)
  • 1000-V Charged-Device Model (C101)
• Supports Digital Applications: Level Translation, PCI Interface, Bus Isolation

SN74CB3T16211 芯片订购指南

器件	状态	温度	价格	封装 | 引脚	封装数量 | 封装载体	丝印标记
74CB3T16211DGGRE4	ACTIVE	-40 to 85	2.10 | 1ku	TSSOP (DGG) | 56	2000
74CB3T16211DGGRG4	ACTIVE	-40 to 85	2.10 | 1ku	TSSOP (DGG) | 56	2000
74CB3T16211DGVRE4	ACTIVE	-40 to 85	2.10 | 1ku	TVSOP (DGV) | 56	2000
74CB3T16211DGVRG4	ACTIVE	-40 to 85	2.10 | 1ku	TVSOP (DGV) | 56	2000
74CB3T16211DLRG4	ACTIVE	-40 to 85	2.30 | 1ku	SSOP (DL) | 56	1000
SN74CB3T16211DGG	PREVIEW	-40 to 85		TSSOP (DGG) | 56	35
SN74CB3T16211DGGR	ACTIVE	-40 to 85	2.10 | 1ku	TSSOP (DGG) | 56	2000
SN74CB3T16211DGVR	ACTIVE	-40 to 85	2.10 | 1ku	TVSOP (DGV) | 56	2000
SN74CB3T16211DL	ACTIVE	-40 to 85	2.75 | 1ku	SSOP (DL) | 56	20
SN74CB3T16211DLG4	ACTIVE	-40 to 85	2.75 | 1ku	SSOP (DL) | 56	20
SN74CB3T16211DLR	ACTIVE	-40 to 85	2.30 | 1ku	SSOP (DL) | 56	1000
SN74CB3T16211GQLR	NRND	-40 to 85	3.15 | 1ku	BGA MICROSTAR JUNIOR (GQL) | 56	1000
SN74CB3T16211ZQLR	ACTIVE	-40 to 85	3.15 | 1ku	BGA MICROSTAR JUNIOR (ZQL) | 56	1000

SN74CB3T16211 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
74CB3T16211DGGRE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	74CB3T16211DGGRE4	74CB3T16211DGGRE4
74CB3T16211DGGRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	74CB3T16211DGGRG4	74CB3T16211DGGRG4
74CB3T16211DGVRE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	74CB3T16211DGVRE4	74CB3T16211DGVRE4
74CB3T16211DGVRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	74CB3T16211DGVRG4	74CB3T16211DGVRG4
74CB3T16211DLRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	74CB3T16211DLRG4	74CB3T16211DLRG4
SN74CB3T16211DGG	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74CB3T16211DGG	SN74CB3T16211DGG
SN74CB3T16211DGGR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74CB3T16211DGGR	SN74CB3T16211DGGR
SN74CB3T16211DGVR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74CB3T16211DGVR	SN74CB3T16211DGVR
SN74CB3T16211DL	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74CB3T16211DL	SN74CB3T16211DL
SN74CB3T16211DLG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74CB3T16211DLG4	SN74CB3T16211DLG4
SN74CB3T16211DLR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74CB3T16211DLR	SN74CB3T16211DLR
SN74CB3T16211GQLR	TBD	SNPB	Level-1-240C-UNLIM	SN74CB3T16211GQLR	SN74CB3T16211GQLR
SN74CB3T16211ZQLR	Green (RoHS & no Sb/Br)	SNAGCU	Level-1-260C-UNLIM	SN74CB3T16211ZQLR	SN74CB3T16211ZQLR

SN74CB3T16211 应用技术支持与电子电路设计开发资源下载

1. SN74CB3T16211 数据资料 dataSheet 下载.PDF
2. TI 德州仪器信号开关产品选型与价格 . xls
3. Logic Guide 2009 (PDF 4263 KB)
4. 防止模拟开关的额外功耗 (PDF 392 KB) (PDF 1305 KB)
5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
9. Designing With Logic (PDF 186 KB)
10. Live Insertion (PDF 150 KB)
11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
14. LOGIC Pocket Data Book (PDF 6001 KB)
15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
16. Logic Cross-Reference (PDF 2938 KB)