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SN74AVC4T774 具有可配置电压转换和 3 态输出的 4 位双电源总线收发器

This 4-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.2 V to 3.6 V. The SN74AVC4T774 is optimized to operate with VCCA/VCCB set at 1.4 V to 3.6 V. It is operational with VCCA/VCCB as low as 1.2 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.

The SN74AVC4T774 is designed for asynchronous communication between data buses. The logic levels of the direction-control (DIR) input and the output-enable (OE) input activate either the B-port outputs or the A-port outputs or place both output ports in the high-impedance mode. The device transmits data from the A bus to the B bus when the B outputs are activated, and from the B bus to the A bus when the A outputs are activated. The input circuitry on both A and B ports is always active and must have a logic HIGH or LOW level applied to prevent excess ICC and ICCZ.

The SN74AVC4T774 is designed so that the control pins (DIR1, DIR2, DIR3, DIR4, and OE) are supplied by VCCA.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The VCC isolation feature ensures that if either VCC input is at GND, then both ports are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE should be tied to VCCA through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Since this device has CMOS inputs, it is very important to not allow them to float. If the inputs are not driven to either a high VCC state, or a low GND state, an undesirable larger than expected ICC current may result. Since the input voltage settlement is governed by many factors (e.g. capacitance, board-layout, package inductance, surrounding conditions, etc.), ensuring that they these inputs are kept out of erroneous switching states and tying them to either a high or a low level minimizes the leakage-current

SN74AVC4T774
Vcc range(V) 1.2 to 3.6
No. of Bits 4
No. of Outputs 2
Bus Drive(ma) -12,12
Output Drive(mA) -12,12
Technology Family AVC
Vmin(V) 1.2
Vmax(V) 3.6
Pin/Package 16TSSOP, 16VQFN, 16UQFN
Operating Temperature Range(°C) -40 to 85
Approx. Price (US$) 0.70 | 1ku
Rating Catalog
SN74AVC4T774 特性
SN74AVC4T774 芯片订购指南
器件 状态 温度 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
74AVC4T774RGYRG4 ACTIVE -40 to 85 0.80 | 1ku VQFN (RGY) | 16 3000 | LARGE T&R  
74AVC4T774RSVRG4 ACTIVE -40 to 85 0.80 | 1ku UQFN (RSV) | 16 3000 | LARGE T&R  
SN74AVC4T774PW ACTIVE -40 to 85 0.85 | 1ku TSSOP (PW) | 16 90 | TUBE  
SN74AVC4T774PWG4 ACTIVE -40 to 85 0.85 | 1ku TSSOP (PW) | 16 90 | TUBE  
SN74AVC4T774PWR ACTIVE -40 to 85 0.70 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
SN74AVC4T774PWRG4 ACTIVE -40 to 85 0.70 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
SN74AVC4T774RGYR ACTIVE -40 to 85 0.80 | 1ku VQFN (RGY) | 16 3000 | LARGE T&R  
SN74AVC4T774RSVR ACTIVE -40 to 85 0.80 | 1ku UQFN (RSV) | 16 3000 | LARGE T&R  
SN74AVC4T774 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
74AVC4T774RGYRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 74AVC4T774RGYRG4 74AVC4T774RGYRG4
74AVC4T774RSVRG4 TBD Call TI Call TI 74AVC4T774RSVRG4 74AVC4T774RSVRG4
SN74AVC4T774PW Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AVC4T774PW SN74AVC4T774PW
SN74AVC4T774PWG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AVC4T774PWG4 SN74AVC4T774PWG4
SN74AVC4T774PWR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AVC4T774PWR SN74AVC4T774PWR
SN74AVC4T774PWRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AVC4T774PWRG4 SN74AVC4T774PWRG4
SN74AVC4T774RGYR Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74AVC4T774RGYR SN74AVC4T774RGYR
SN74AVC4T774RSVR TBD Call TI Call TI SN74AVC4T774RSVR SN74AVC4T774RSVR
SN74AVC4T774 应用技术支持与电子电路设计开发资源下载
  1. SN74AVC4T774 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器电压电平转换产品选型与价格 . xls
  3. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  4. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  5. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  6. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  7. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  8. Designing With Logic (PDF 186 KB)
  9. Live Insertion (PDF 150 KB)
  10. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  11. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  12. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  13. LOGIC Pocket Data Book (PDF 6001 KB)
  14. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  15. Logic Cross-Reference (PDF 2938 KB)