The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
The SN74AUP2G32 performs the Boolean function Y = A + B or Y = A\ o B\ in positive logic.
NanoStarTM package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff
| SN74AUP2G32 | |
| Pin/Package | 8DSBGA, 8UQFN, 8US8, 8X2SON |
| Operating Temperature Range(°C) | -40 to 85 |
| IOL(mA) | 4 |
| IOH(mA) | -4 |
| Vcc max(V) | 3.6 |
| Technology Family | AUP |
| Vcc min(V) | 0.8 |
| Approx. Price (US$) | 0.23 | 1ku |
| No. of Gates | 2 |
| tpd max(ns) | 4.3 |
| ICC(uA) | 0.9 |
| Rating | Catalog |
| 器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| SN74AUP2G32DCUR | ACTIVE | -40 to 85 | 0.24 | 1ku | US8 (DCU) | 8 | 3000 | LARGE T&R | |
| SN74AUP2G32DQER | ACTIVE | -40 to 85 | 0.23 | 1ku | X2SON (DQE) | 8 | 5000 | LARGE T&R | |
| SN74AUP2G32RSER | ACTIVE | -40 to 85 | 0.24 | 1ku | UQFN (RSE) | 8 | 5000 | LARGE T&R | |
| SN74AUP2G32YFPR | ACTIVE | -40 to 85 | 0.33 | 1ku | DSBGA (YZD) | 8 | 3000 | LARGE T&R |
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| SN74AUP2G32DCUR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74AUP2G32DCUR | SN74AUP2G32DCUR |
| SN74AUP2G32DQER | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | SN74AUP2G32DQER | SN74AUP2G32DQER |
| SN74AUP2G32RSER | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74AUP2G32RSER | SN74AUP2G32RSER |
| SN74AUP2G32YFPR | Green (RoHS & no Sb/Br) | SNAGCU | Level-1-260C-UNLIM | SN74AUP2G32YFPR | SN74AUP2G32YFPR |