The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
The SN74AUP2G241 is designed specifically to improve both the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.
NanoStarTM package technology is a major breakthrough in IC packaging concepts, using the die as the package
| SN74AUP2G241 | |
| Pin/Package | 8DSBGA, 8US8, 8X2SON, 8UQFN |
| Operating Temperature Range(°C) | -40 to 85 |
| IOL(mA) | 4 |
| IOH(mA) | -4 |
| Vcc max(V) | 3.6 |
| Technology Family | AUP |
| Vcc min(V) | 0.8 |
| Approx. Price (US$) | 0.23 | 1ku |
| No. of Gates | 2 |
| tpd max(ns) | 4.3 |
| ICC(uA) | 0.9 |
| 器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| SN74AUP2G241DCUR | ACTIVE | -40 to 85 | 0.24 | 1ku | US8 (DCU) | 8 | 3000 | LARGE T&R | |
| SN74AUP2G241DQER | ACTIVE | -40 to 85 | 0.23 | 1ku | X2SON (DQE) | 8 | 5000 | LARGE T&R | |
| SN74AUP2G241RSER | ACTIVE | -40 to 85 | 0.24 | 1ku | UQFN (RSE) | 8 | 5000 | LARGE T&R | |
| SN74AUP2G241YFPR | ACTIVE | -40 to 85 | 0.33 | 1ku | DSBGA (YZP) | 8 | 3000 | LARGE T&R |
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| SN74AUP2G241DCUR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74AUP2G241DCUR | SN74AUP2G241DCUR |
| SN74AUP2G241DQER | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | SN74AUP2G241DQER | SN74AUP2G241DQER |
| SN74AUP2G241RSER | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74AUP2G241RSER | SN74AUP2G241RSER |
| SN74AUP2G241YFPR | Green (RoHS & no Sb/Br) | SNAGCU | Level-1-260C-UNLIM | SN74AUP2G241YFPR | SN74AUP2G241YFPR |