The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
This single positive-edge-triggered D-type flip-flop is designed for 0.8-V to 3.6-V VCC operation.
A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs. To better optimize the flip-flop for higher frequencies, the CLR input overrides the PRE input when they are both low.
NanoStarTM package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down
| SN74AUP1G74 | |
| Pin/Package | 8DSBGA, 8UQFN, 8US8, 8X2SON |
| Operating Temperature Range(°C) | -40 to 85 |
| IOL(mA) | 4 |
| IOH(mA) | -4 |
| Vcc max(V) | 3.6 |
| Technology Family | AUP |
| Vcc min(V) | 0.8 |
| Approx. Price (US$) | 0.28 | 1ku |
| th(ns) | 0 |
| tsu(ns) | 0.5 |
| Vcc range(V) | -0.5 to 4.6 |
| tpd max(ns) | 2 |
| ICC(uA) | 0.9 |
| Rating | Catalog |
| 器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| SN74AUP1G74DCUR | ACTIVE | -40 to 85 | 0.29 | 1ku | US8 (DCU) | 8 | 3000 | LARGE T&R | |
| SN74AUP1G74DCURG4 | ACTIVE | -40 to 85 | 0.29 | 1ku | US8 (DCU) | 8 | 3000 | LARGE T&R | |
| SN74AUP1G74DQER | ACTIVE | -40 to 85 | 0.28 | 1ku | X2SON (DQE) | 8 | 5000 | LARGE T&R | |
| SN74AUP1G74RSER | ACTIVE | -40 to 85 | 0.29 | 1ku | UQFN (RSE) | 8 | 5000 | LARGE T&R | |
| SN74AUP1G74YFPR | ACTIVE | -40 to 85 | 0.37 | 1ku | DSBGA (YZD) | 8 | 3000 | LARGE T&R | |
| SN74AUP1G74YZPR | ACTIVE | -40 to 85 | 0.40 | 1ku | DSBGA (YZD) | 8 | 3000 | LARGE T&R |
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| SN74AUP1G74DCUR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74AUP1G74DCUR | SN74AUP1G74DCUR |
| SN74AUP1G74DCURG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74AUP1G74DCURG4 | SN74AUP1G74DCURG4 |
| SN74AUP1G74DQER | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | SN74AUP1G74DQER | SN74AUP1G74DQER |
| SN74AUP1G74RSER | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74AUP1G74RSER | SN74AUP1G74RSER |
| SN74AUP1G74YFPR | Green (RoHS & no Sb/Br) | SNAGCU | Level-1-260C-UNLIM | SN74AUP1G74YFPR | SN74AUP1G74YFPR |
| SN74AUP1G74YZPR | Green (RoHS & no Sb/Br) | SNAGCU | Level-1-260C-UNLIM | SN74AUP1G74YZPR | SN74AUP1G74YZPR |