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SN74AUP1G58 低功耗可配置多功能门

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity, which produces very low undershoot and overshoot characteristics.

The SN74AUP1G58 features configurable multiple functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XNOR, inverter, and noninverter. All inputs can be connected to VCC or GND.

The device functions as an independent gate with Schmitt-trigger inputs, which allow for slow input transition and better switching noise immunity at the input.

NanoStarTM package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down

SN74AUP1G58
tpd max(ns) 5.5,6.3,7,8.7
Pin/Package 6DSBGA, 6SC70, 6SON, 6SOT, 6SOT-23
IOH(mA) -4
IOL(mA) 4
Vcc min(V) 0.8
Vcc max(V) 3.6
Performance Optimized
Approx. Price (US$) 0.17 | 1ku
Operating Temperature Range(°C) -40 to 85
Technology Family AUP
ICC(uA) 0.9
Rating Catalog
SN74AUP1G58 特性
SN74AUP1G58 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN74AUP1G58DBVR ACTIVE -40 to 85 0.17 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R  
SN74AUP1G58DBVRE4 ACTIVE -40 to 85 0.17 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R  
SN74AUP1G58DBVRG4 ACTIVE -40 to 85 0.17 | 1ku SOT-23 (DBV) | 6 3000 | LARGE T&R  
SN74AUP1G58DBVT ACTIVE -40 to 85 0.50 | 1ku SOT-23 (DBV) | 6 250 | SMALL T&R  
SN74AUP1G58DBVTE4 ACTIVE -40 to 85 0.50 | 1ku SOT-23 (DBV) | 6 250 | SMALL T&R  
SN74AUP1G58DBVTG4 ACTIVE -40 to 85 0.50 | 1ku SOT-23 (DBV) | 6 250 | SMALL T&R  
SN74AUP1G58DCKR ACTIVE -40 to 85 0.17 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R  
SN74AUP1G58DCKRE4 ACTIVE -40 to 85 0.17 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R  
SN74AUP1G58DCKRG4 ACTIVE -40 to 85 0.17 | 1ku SC70 (DCK) | 6 3000 | LARGE T&R  
SN74AUP1G58DCKT ACTIVE -40 to 85 0.50 | 1ku SC70 (DCK) | 6 250 | SMALL T&R  
SN74AUP1G58DCKTE4 ACTIVE -40 to 85 0.50 | 1ku SC70 (DCK) | 6 250 | SMALL T&R  
SN74AUP1G58DCKTG4 ACTIVE -40 to 85 0.50 | 1ku SC70 (DCK) | 6 250 | SMALL T&R  
SN74AUP1G58DRLR ACTIVE -40 to 85 0.21 | 1ku SOT (DRL) | 6 4000 | LARGE T&R  
SN74AUP1G58DRLRG4 ACTIVE -40 to 85 0.21 | 1ku SOT (DRL) | 6 4000 | LARGE T&R  
SN74AUP1G58DRYR ACTIVE -40 to 85 0.20 | 1ku SON (DRY) | 6 5000 | LARGE T&R  
SN74AUP1G58DSFR ACTIVE -40 to 85 0.19 | 1ku SON (DSF) | 6 5000 | LARGE T&R  
SN74AUP1G58YFPR ACTIVE 0.28 | 1ku DSBGA (YFP) | 6 3000 | LARGE T&R  
SN74AUP1G58YZPR ACTIVE -40 to 85 0.30 | 1ku DSBGA (YZP) | 6 3000 | LARGE T&R  
SN74AUP1G58 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN74AUP1G58DBVR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G58DBVR SN74AUP1G58DBVR
SN74AUP1G58DBVRE4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G58DBVRE4 SN74AUP1G58DBVRE4
SN74AUP1G58DBVRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G58DBVRG4 SN74AUP1G58DBVRG4
SN74AUP1G58DBVT Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G58DBVT SN74AUP1G58DBVT
SN74AUP1G58DBVTE4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G58DBVTE4 SN74AUP1G58DBVTE4
SN74AUP1G58DBVTG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G58DBVTG4 SN74AUP1G58DBVTG4
SN74AUP1G58DCKR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G58DCKR SN74AUP1G58DCKR
SN74AUP1G58DCKRE4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G58DCKRE4 SN74AUP1G58DCKRE4
SN74AUP1G58DCKRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G58DCKRG4 SN74AUP1G58DCKRG4
SN74AUP1G58DCKT Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G58DCKT SN74AUP1G58DCKT
SN74AUP1G58DCKTE4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G58DCKTE4 SN74AUP1G58DCKTE4
SN74AUP1G58DCKTG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G58DCKTG4 SN74AUP1G58DCKTG4
SN74AUP1G58DRLR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G58DRLR SN74AUP1G58DRLR
SN74AUP1G58DRLRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G58DRLRG4 SN74AUP1G58DRLRG4
SN74AUP1G58DRYR Green (RoHS & no Sb/Br) NIPDAU Level-1-260C-UNLIM SN74AUP1G58DRYR SN74AUP1G58DRYR
SN74AUP1G58DSFR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G58DSFR SN74AUP1G58DSFR
SN74AUP1G58YFPR Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM SN74AUP1G58YFPR SN74AUP1G58YFPR
SN74AUP1G58YZPR Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM SN74AUP1G58YZPR SN74AUP1G58YZPR
SN74AUP1G58 应用技术支持与电子电路设计开发资源下载
  1. SN74AUP1G58 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器小尺寸逻辑器件产品选型与价格 . xls
  3. Logic Guide 2009 (PDF 4263 KB)
  4. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  9. Designing With Logic (PDF 186 KB)
  10. Live Insertion (PDF 150 KB)
  11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  14. LOGIC Pocket Data Book (PDF 6001 KB)
  15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  16. Logic Cross-Reference (PDF 2938 KB)