SN74AUP1G32 低功耗单路 2 输入正或门

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity (see Figure 1 and Figure 2).

This single 2-input positive-OR gate performs the Boolean function Y = A + B or Y = A\ o B\ in positive logic.

NanoStarTM package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down

	SN74AUP1G32
Pin/Package	5DSBGA, 5SC70, 5SOT, 5SOT-23, 6DSBGA, 6SON
Operating Temperature Range(°C)	-40 to 85
IOL(mA)	4
IOH(mA)	-4
Vcc max(V)	3.6
Technology Family	AUP
Vcc min(V)	0.8
Approx. Price (US$)	0.13 \| 1ku
tpd max(ns)	6.4
ICC(uA)	0.5
Rating	Catalog

SN74AUP1G32 特性

Available in the Texas Instruments NanoStarTM Package
Low Static-Power Consumption
(ICC = 0.9 uA Max)
Low Dynamic-Power Consumption
(Cpd = 4.3 pF Typ at 3.3 V)
Low Input Capacitance (CI = 1.5 pF Typ)
Low Noise – Overshoot and Undershoot
<10% of VCC
Ioff Supports Partial-Power-Down Mode Operation
Input Hysteresis Allows Slow Input Transition and Better Switching Noise
Immunity at the
Input (Vhys = 250 mV Typ at 3.3 V)
Wide Operating VCC Range of 0.8 V to 3.6 V
Optimized for 3.3-V Operation
3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
tpd = 4.6 ns Max at 3.3 V
Suitable for Point-to-Point Applications
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
  (A114-B, Class II)
- 1000-V Charged-Device Model (C101)

SN74AUP1G32 芯片订购指南

器件	状态	温度	价格	封装 \| 引脚	封装数量 \| 封装载体	丝印标记
SN74AUP1G32DBVR	ACTIVE	-40 to 85	0.13 \| 1ku	SOT-23 (DBV) \| 5	3000 \| LARGE T&R
SN74AUP1G32DBVRE4	ACTIVE	-40 to 85	0.13 \| 1ku	SOT-23 (DBV) \| 5	3000 \| LARGE T&R
SN74AUP1G32DBVRG4	ACTIVE	-40 to 85	0.13 \| 1ku	SOT-23 (DBV) \| 5	3000 \| LARGE T&R
SN74AUP1G32DBVT	ACTIVE	-40 to 85	0.46 \| 1ku	SOT-23 (DBV) \| 5	250 \| SMALL T&R
SN74AUP1G32DBVTE4	ACTIVE	-40 to 85	0.46 \| 1ku	SOT-23 (DBV) \| 5	250 \| SMALL T&R
SN74AUP1G32DBVTG4	ACTIVE	-40 to 85	0.46 \| 1ku	SOT-23 (DBV) \| 5	250 \| SMALL T&R
SN74AUP1G32DCKR	ACTIVE	-40 to 85	0.13 \| 1ku	SC70 (DCK) \| 5	3000 \| LARGE T&R
SN74AUP1G32DCKRE4	ACTIVE	-40 to 85	0.13 \| 1ku	SC70 (DCK) \| 5	3000 \| LARGE T&R
SN74AUP1G32DCKRG4	ACTIVE	-40 to 85	0.13 \| 1ku	SC70 (DCK) \| 5	3000 \| LARGE T&R
SN74AUP1G32DCKT	ACTIVE	-40 to 85	0.46 \| 1ku	SC70 (DCK) \| 5	250 \| SMALL T&R
SN74AUP1G32DCKTE4	ACTIVE	-40 to 85	0.46 \| 1ku	SC70 (DCK) \| 5	250 \| SMALL T&R
SN74AUP1G32DCKTG4	ACTIVE	-40 to 85	0.46 \| 1ku	SC70 (DCK) \| 5	250 \| SMALL T&R
SN74AUP1G32DRLR	ACTIVE	-40 to 85	0.16 \| 1ku	SOT (DRL) \| 5	4000 \| LARGE T&R
SN74AUP1G32DRLRG4	ACTIVE	-40 to 85	0.16 \| 1ku	SOT (DRL) \| 5	4000 \| LARGE T&R
SN74AUP1G32DRYR	ACTIVE	-40 to 85	0.15 \| 1ku	SON (DRY) \| 6	5000 \| LARGE T&R
SN74AUP1G32DSFR	ACTIVE	-40 to 85	0.14 \| 1ku	SON (DSF) \| 6	5000 \| LARGE T&R
SN74AUP1G32YFPR	ACTIVE		0.24 \| 1ku	DSBGA (YFF) \| 6	3000 \| LARGE T&R
SN74AUP1G32YZPR	ACTIVE	-40 to 85	0.26 \| 1ku	DSBGA (YZU) \| 5	3000 \| LARGE T&R

SN74AUP1G32 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
SN74AUP1G32DBVR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G32DBVR	SN74AUP1G32DBVR
SN74AUP1G32DBVRE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G32DBVRE4	SN74AUP1G32DBVRE4
SN74AUP1G32DBVRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G32DBVRG4	SN74AUP1G32DBVRG4
SN74AUP1G32DBVT	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G32DBVT	SN74AUP1G32DBVT
SN74AUP1G32DBVTE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G32DBVTE4	SN74AUP1G32DBVTE4
SN74AUP1G32DBVTG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G32DBVTG4	SN74AUP1G32DBVTG4
SN74AUP1G32DCKR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G32DCKR	SN74AUP1G32DCKR
SN74AUP1G32DCKRE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G32DCKRE4	SN74AUP1G32DCKRE4
SN74AUP1G32DCKRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G32DCKRG4	SN74AUP1G32DCKRG4
SN74AUP1G32DCKT	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G32DCKT	SN74AUP1G32DCKT
SN74AUP1G32DCKTE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G32DCKTE4	SN74AUP1G32DCKTE4
SN74AUP1G32DCKTG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G32DCKTG4	SN74AUP1G32DCKTG4
SN74AUP1G32DRLR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G32DRLR	SN74AUP1G32DRLR
SN74AUP1G32DRLRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G32DRLRG4	SN74AUP1G32DRLRG4
SN74AUP1G32DRYR	Green (RoHS & no Sb/Br)	NIPDAU	Level-1-260C-UNLIM	SN74AUP1G32DRYR	SN74AUP1G32DRYR
SN74AUP1G32DSFR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G32DSFR	SN74AUP1G32DSFR
SN74AUP1G32YFPR	Green (RoHS & no Sb/Br)	SNAGCU	Level-1-260C-UNLIM	SN74AUP1G32YFPR	SN74AUP1G32YFPR
SN74AUP1G32YZPR	Green (RoHS & no Sb/Br)	SNAGCU	Level-1-260C-UNLIM	SN74AUP1G32YZPR	SN74AUP1G32YZPR

SN74AUP1G32 应用技术支持与电子电路设计开发资源下载

SN74AUP1G32 数据资料 dataSheet 下载.PDF
TI 德州仪器门电路产品选型与价格 . xls
Logic Guide 2009 (PDF 4263 KB)
Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
CMOS Power Consumption and CPD Calculation (PDF 89 KB)
Designing With Logic (PDF 186 KB)
Live Insertion (PDF 150 KB)
Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
HiRel Unitrode Power Management Brochure (PDF 206 KB)
LOGIC Pocket Data Book (PDF 6001 KB)
HiRel Unitrode Power Management Brochure (PDF 206 KB)
Logic Cross-Reference (PDF 2938 KB)