SN74AUP1G17 低功耗单路施密特触发缓冲器

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity (see Figure 1 and Figure 2).

This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching-noise immunity at the input.

NanoStarTM package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down

	SN74AUP1G17
Pin/Package	4DSBGA, 5DSBGA, 5SC70, 5SOT, 5SOT-23, 6SON
Operating Temperature Range(°C)	-40 to 85
IOL(mA)	4
IOH(mA)	-4
Vcc max(V)	3.6
Technology Family	AUP
Vcc min(V)	0.8
Approx. Price (US$)	0.13 | 1ku
tpd max(ns)	5.1,5.7,6.2,7.7
ICC(uA)	0.9
Voltage Node(V)	3.3
Rating	Catalog

SN74AUP1G17 特性

• Available in the Texas Instruments NanoStarTM Package
• Low Static-Power Consumption (ICC = 0.9 uA Max)
• Low Dynamic-Power Consumption (Cpd = 4.4 pF Typ at 3.3 V)
• Low Input Capacitance (Ci = 1.5 pF Typ)
• Low Noise – Overshoot and Undershoot <10% of VCC
• Ioff Supports Partial-Power-Down Mode Operation
• Includes Schmitt-Trigger Inputs
• Wide Operating VCC Range of 0.8 V to 3.6 V
• Optimized for 3.3-V Operation
• 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
• tpd = 5.1 ns Max at 3.3 V
• Suitable for Point-to-Point Applications
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Performance Tested Per JESD 22
  • 2000-V Human-Body Model (A114-B, Class II)
  • 1000-V Charged-Device Model (C101)

SN74AUP1G17 芯片订购指南

器件	状态	温度	价格	封装 | 引脚	封装数量 | 封装载体	丝印标记
SN74AUP1G17DBVR	ACTIVE	-40 to 85	0.13 | 1ku	SOT-23 (DBV) | 5	3000 | LARGE T&R
SN74AUP1G17DBVRE4	ACTIVE	-40 to 85	0.13 | 1ku	SOT-23 (DBV) | 5	3000 | LARGE T&R
SN74AUP1G17DBVRG4	ACTIVE	-40 to 85	0.13 | 1ku	SOT-23 (DBV) | 5	3000 | LARGE T&R
SN74AUP1G17DBVT	ACTIVE	-40 to 85	0.46 | 1ku	SOT-23 (DBV) | 5	250 | SMALL T&R
SN74AUP1G17DBVTE4	ACTIVE	-40 to 85	0.46 | 1ku	SOT-23 (DBV) | 5	250 | SMALL T&R
SN74AUP1G17DBVTG4	ACTIVE	-40 to 85	0.46 | 1ku	SOT-23 (DBV) | 5	250 | SMALL T&R
SN74AUP1G17DCKR	ACTIVE	-40 to 85	0.13 | 1ku	SC70 (DCK) | 5	3000 | LARGE T&R
SN74AUP1G17DCKRE4	ACTIVE	-40 to 85	0.13 | 1ku	SC70 (DCK) | 5	3000 | LARGE T&R
SN74AUP1G17DCKRG4	ACTIVE	-40 to 85	0.13 | 1ku	SC70 (DCK) | 5	3000 | LARGE T&R
SN74AUP1G17DCKT	ACTIVE	-40 to 85	0.46 | 1ku	SC70 (DCK) | 5	250 | SMALL T&R
SN74AUP1G17DCKTE4	ACTIVE	-40 to 85	0.46 | 1ku	SC70 (DCK) | 5	250 | SMALL T&R
SN74AUP1G17DCKTG4	ACTIVE	-40 to 85	0.46 | 1ku	SC70 (DCK) | 5	250 | SMALL T&R
SN74AUP1G17DRLR	ACTIVE	-40 to 85	0.16 | 1ku	SOT (DRL) | 5	4000 | LARGE T&R
SN74AUP1G17DRLRG4	ACTIVE	-40 to 85	0.16 | 1ku	SOT (DRL) | 5	4000 | LARGE T&R
SN74AUP1G17DRYR	ACTIVE	-40 to 85	0.15 | 1ku	SON (DRY) | 6	5000 | LARGE T&R
SN74AUP1G17DSFR	ACTIVE	-40 to 85	0.14 | 1ku	SON (DSF) | 6	5000 | LARGE T&R
SN74AUP1G17YFPR	ACTIVE		0.24 | 1ku	DSBGA (YFF) | 4	3000 | LARGE T&R
SN74AUP1G17YZPR	ACTIVE	-40 to 85	0.26 | 1ku	DSBGA (YZU) | 5	3000 | LARGE T&R

SN74AUP1G17 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
SN74AUP1G17DBVR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G17DBVR	SN74AUP1G17DBVR
SN74AUP1G17DBVRE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G17DBVRE4	SN74AUP1G17DBVRE4
SN74AUP1G17DBVRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G17DBVRG4	SN74AUP1G17DBVRG4
SN74AUP1G17DBVT	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G17DBVT	SN74AUP1G17DBVT
SN74AUP1G17DBVTE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G17DBVTE4	SN74AUP1G17DBVTE4
SN74AUP1G17DBVTG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G17DBVTG4	SN74AUP1G17DBVTG4
SN74AUP1G17DCKR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G17DCKR	SN74AUP1G17DCKR
SN74AUP1G17DCKRE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G17DCKRE4	SN74AUP1G17DCKRE4
SN74AUP1G17DCKRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G17DCKRG4	SN74AUP1G17DCKRG4
SN74AUP1G17DCKT	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G17DCKT	SN74AUP1G17DCKT
SN74AUP1G17DCKTE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G17DCKTE4	SN74AUP1G17DCKTE4
SN74AUP1G17DCKTG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G17DCKTG4	SN74AUP1G17DCKTG4
SN74AUP1G17DRLR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G17DRLR	SN74AUP1G17DRLR
SN74AUP1G17DRLRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G17DRLRG4	SN74AUP1G17DRLRG4
SN74AUP1G17DRYR	Green (RoHS & no Sb/Br)	NIPDAU	Level-1-260C-UNLIM	SN74AUP1G17DRYR	SN74AUP1G17DRYR
SN74AUP1G17DSFR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G17DSFR	SN74AUP1G17DSFR
SN74AUP1G17YFPR	Green (RoHS & no Sb/Br)	SNAGCU	Level-1-260C-UNLIM	SN74AUP1G17YFPR	SN74AUP1G17YFPR
SN74AUP1G17YZPR	Green (RoHS & no Sb/Br)	SNAGCU	Level-1-260C-UNLIM	SN74AUP1G17YZPR	SN74AUP1G17YZPR

SN74AUP1G17 应用技术支持与电子电路设计开发资源下载

1. SN74AUP1G17 数据资料 dataSheet 下载.PDF
2. TI 德州仪器小尺寸逻辑器件产品选型与价格 . xls
3. Logic Guide 2009 (PDF 4263 KB)
4. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
9. Designing With Logic (PDF 186 KB)
10. Live Insertion (PDF 150 KB)
11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
14. LOGIC Pocket Data Book (PDF 6001 KB)
15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
16. Logic Cross-Reference (PDF 2938 KB)