首页 > TI 德州仪器 > 逻辑 > 门电路

SN74AUP1G08 低功耗单路 2 输入正与门

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

This single 2-input positive-AND gate performs the Boolean function Y = A o B or Y = A\ + B\ in positive logic.

NanoStarTM package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff

SN74AUP1G08
Pin/Package 5DSBGA, 5SC70, 5SOT, 5SOT-23
Operating Temperature Range(°C) -40 to 85
IOL(mA) 4
IOH(mA) -4
Performance Optimized
Vcc max(V) 3.6
Technology Family AUP
Vcc min(V) 0.8
Approx. Price (US$) 0.13 | 1ku
tpd max(ns) 4.3
ICC(uA) 0.9
Rating Catalog
SN74AUP1G08 特性
SN74AUP1G08 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN74AUP1G08DBVR ACTIVE -40 to 85 0.13 | 1ku SOT-23 (DBV) | 5 3000 | LARGE T&R  
SN74AUP1G08DBVRE4 ACTIVE -40 to 85 0.13 | 1ku SOT-23 (DBV) | 5 3000 | LARGE T&R  
SN74AUP1G08DBVRG4 ACTIVE -40 to 85 0.13 | 1ku SOT-23 (DBV) | 5 3000 | LARGE T&R  
SN74AUP1G08DCKR ACTIVE -40 to 85 0.13 | 1ku SC70 (DCK) | 5 3000 | LARGE T&R  
SN74AUP1G08DCKRE4 ACTIVE -40 to 85 0.13 | 1ku SC70 (DCK) | 5 3000 | LARGE T&R  
SN74AUP1G08DCKRG4 ACTIVE -40 to 85 0.13 | 1ku SC70 (DCK) | 5 3000 | LARGE T&R  
SN74AUP1G08DRLR ACTIVE -40 to 85 0.16 | 1ku SOT (DRL) | 5 4000 | LARGE T&R  
SN74AUP1G08DRLRG4 ACTIVE -40 to 85 0.16 | 1ku SOT (DRL) | 5 4000 | LARGE T&R  
SN74AUP1G08YZPR ACTIVE -40 to 85 0.26 | 1ku DSBGA (YZP) | 5 3000 | LARGE T&R  
SN74AUP1G08 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN74AUP1G08DBVR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G08DBVR SN74AUP1G08DBVR
SN74AUP1G08DBVRE4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G08DBVRE4 SN74AUP1G08DBVRE4
SN74AUP1G08DBVRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G08DBVRG4 SN74AUP1G08DBVRG4
SN74AUP1G08DCKR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G08DCKR SN74AUP1G08DCKR
SN74AUP1G08DCKRE4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G08DCKRE4 SN74AUP1G08DCKRE4
SN74AUP1G08DCKRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G08DCKRG4 SN74AUP1G08DCKRG4
SN74AUP1G08DRLR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G08DRLR SN74AUP1G08DRLR
SN74AUP1G08DRLRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G08DRLRG4 SN74AUP1G08DRLRG4
SN74AUP1G08YZPR Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM SN74AUP1G08YZPR SN74AUP1G08YZPR
SN74AUP1G08 应用技术支持与电子电路设计开发资源下载
  1. SN74AUP1G08 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器门电路产品选型与价格 . xls
  3. Logic Guide 2009 (PDF 4263 KB)
  4. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  9. Designing With Logic (PDF 186 KB)
  10. Live Insertion (PDF 150 KB)
  11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  14. LOGIC Pocket Data Book (PDF 6001 KB)
  15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  16. Logic Cross-Reference (PDF 2938 KB)