SN74AUP1G00 低功耗单路 2 输入正与非门

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see Figure 1 and Figure 2).

This single 2-input positive-NAND gate performs the Boolean function Y = A o B or Y = A + B in positive logic.

NanoStarTM package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down

	SN74AUP1G00
Rating	Catalog
Technology Family	AUP

SN74AUP1G00 特性

• Available in the Texas Instruments NanoStarTM Package
• Low Static-Power Consumption
  (ICC = 0.9 uA Max)
• Low Dynamic-Power Consumption
  (Cpd = 4 pF Typ at 3.3 V)
• Low Input Capacitance (Ci = 1.5 pF Typ)
• Low Noise Overshoot and Undershoot
  <10% of VCC
• Ioff Supports Partial-Power-Down Mode Operation
• Input Hysteresis Allows Slow Input Transition and Better Switching Noise
  Immunity at Input
  (Vhys = 250 mV Typ at 3.3 V)
• Wide Operating VCC Range of 0.8 V to 3.6 V
• Optimized for 3.3-V Operation
• 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
• tpd = 4.8 ns Max at 3.3 V
• Suitable for Point-to-Point Applications
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Performance Tested Per JESD 22
  • 2000-V Human-Body Model
    (A114-B, Class II)
  • 1000-V Charged-Device Model (C101)

SN74AUP1G00 芯片订购指南

器件	状态	温度	价格	封装 | 引脚	封装数量 | 封装载体	丝印标记
SN74AUP1G00DBVR	ACTIVE	-40 to 85	0.13 | 1ku	SOT-23 (DBV) | 5	3000 | LARGE T&R
SN74AUP1G00DBVRE4	ACTIVE	-40 to 85	0.13 | 1ku	SOT-23 (DBV) | 5	3000 | LARGE T&R
SN74AUP1G00DBVRG4	ACTIVE	-40 to 85	0.13 | 1ku	SOT-23 (DBV) | 5	3000 | LARGE T&R
SN74AUP1G00DBVT	ACTIVE	-40 to 85	0.46 | 1ku	SOT-23 (DBV) | 5	250 | SMALL T&R
SN74AUP1G00DBVTE4	ACTIVE	-40 to 85	0.46 | 1ku	SOT-23 (DBV) | 5	250 | SMALL T&R
SN74AUP1G00DBVTG4	ACTIVE	-40 to 85	0.46 | 1ku	SOT-23 (DBV) | 5	250 | SMALL T&R
SN74AUP1G00DCKR	ACTIVE	-40 to 85	0.13 | 1ku	SC70 (DCK) | 5	3000 | LARGE T&R
SN74AUP1G00DCKRE4	ACTIVE	-40 to 85	0.13 | 1ku	SC70 (DCK) | 5	3000 | LARGE T&R
SN74AUP1G00DCKRG4	ACTIVE	-40 to 85	0.13 | 1ku	SC70 (DCK) | 5	3000 | LARGE T&R
SN74AUP1G00DCKT	ACTIVE	-40 to 85	0.46 | 1ku	SC70 (DCK) | 5	250 | SMALL T&R
SN74AUP1G00DCKTE4	ACTIVE	-40 to 85	0.46 | 1ku	SC70 (DCK) | 5	250 | SMALL T&R
SN74AUP1G00DCKTG4	ACTIVE	-40 to 85	0.46 | 1ku	SC70 (DCK) | 5	250 | SMALL T&R
SN74AUP1G00DRLR	ACTIVE	-40 to 85	0.16 | 1ku	SOT (DRL) | 5	4000 | LARGE T&R
SN74AUP1G00DRLRG4	ACTIVE	-40 to 85	0.16 | 1ku	SOT (DRL) | 5	4000 | LARGE T&R
SN74AUP1G00DRYR	ACTIVE	-40 to 85	0.15 | 1ku	SON (DRY) | 6	5000 | LARGE T&R
SN74AUP1G00DSFR	ACTIVE	-40 to 85	0.14 | 1ku	SON (DSF) | 6	5000 | LARGE T&R
SN74AUP1G00YFPR	ACTIVE		0.24 | 1ku	DSBGA (YFF) | 6	3000 | LARGE T&R
SN74AUP1G00YZPR	ACTIVE	-40 to 85	0.26 | 1ku	DSBGA (YZU) | 5	3000 | LARGE T&R

SN74AUP1G00 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
SN74AUP1G00DBVR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G00DBVR	SN74AUP1G00DBVR
SN74AUP1G00DBVRE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G00DBVRE4	SN74AUP1G00DBVRE4
SN74AUP1G00DBVRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G00DBVRG4	SN74AUP1G00DBVRG4
SN74AUP1G00DBVT	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G00DBVT	SN74AUP1G00DBVT
SN74AUP1G00DBVTE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G00DBVTE4	SN74AUP1G00DBVTE4
SN74AUP1G00DBVTG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G00DBVTG4	SN74AUP1G00DBVTG4
SN74AUP1G00DCKR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G00DCKR	SN74AUP1G00DCKR
SN74AUP1G00DCKRE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G00DCKRE4	SN74AUP1G00DCKRE4
SN74AUP1G00DCKRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G00DCKRG4	SN74AUP1G00DCKRG4
SN74AUP1G00DCKT	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G00DCKT	SN74AUP1G00DCKT
SN74AUP1G00DCKTE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G00DCKTE4	SN74AUP1G00DCKTE4
SN74AUP1G00DCKTG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G00DCKTG4	SN74AUP1G00DCKTG4
SN74AUP1G00DRLR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G00DRLR	SN74AUP1G00DRLR
SN74AUP1G00DRLRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G00DRLRG4	SN74AUP1G00DRLRG4
SN74AUP1G00DRYR	Green (RoHS & no Sb/Br)	NIPDAU	Level-1-260C-UNLIM	SN74AUP1G00DRYR	SN74AUP1G00DRYR
SN74AUP1G00DSFR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74AUP1G00DSFR	SN74AUP1G00DSFR
SN74AUP1G00YFPR	Green (RoHS & no Sb/Br)	SNAGCU	Level-1-260C-UNLIM	SN74AUP1G00YFPR	SN74AUP1G00YFPR
SN74AUP1G00YZPR	Green (RoHS & no Sb/Br)	SNAGCU	Level-1-260C-UNLIM	SN74AUP1G00YZPR	SN74AUP1G00YZPR

SN74AUP1G00 应用技术支持与电子电路设计开发资源下载

1. SN74AUP1G00 数据资料 dataSheet 下载.PDF
2. TI 德州仪器门电路产品选型与价格 . xls
3. Logic Guide 2009 (PDF 4263 KB)
4. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
9. Designing With Logic (PDF 186 KB)
10. Live Insertion (PDF 150 KB)
11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
14. LOGIC Pocket Data Book (PDF 6001 KB)
15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
16. Logic Cross-Reference (PDF 2938 KB)