SN74ABTH162260 具有串联阻尼电阻和三态输出的 12 位到 24 位多路复用 D 类锁存器
The 'ABTH162260 are 12-bit to 24-bit multiplexed D-type latches used in applications where two separate data paths must be multiplexed onto, or demultiplexed from, a single data path. Typical applications include multiplexing and/or demultiplexing of address and data information in microprocessor or bus-interface applications. These devices are also useful in memory-interleaving applications.
Three 12-bit I/O ports (A1-A12, 1B1-1B12, and 2B1-2B12) are available for address and/or data transfer. The output-enable (OE1B\, OE2B\, and OEA\) inputs control the bus-transceiver functions. The OE1B\ and OE2B\ control signals also allow bank control in the A-to-B direction.
Address and/or data information can be stored using the internal storage latches
|
SN74ABTH162260 |
| Voltage Nodes(V) |
5 |
| Technology Family |
ABT |
| Rating |
Catalog |
SN74ABTH162260 特性
- Members of the Texas Instruments WidebusTM Family
- B-Port Outputs Have Equivalent 25- Series Resistors, So No External Resistors Are Required
- State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
- Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
- Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
- High-Impedance State During Power Up and Power Down
- Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
- Flow-Through Architecture Optimizes PCB Layout
- Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
- Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Package and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings
SN74ABTH162260 芯片订购指南
| 器件 |
状态 |
温度 |
价格（美元） |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| SN74ABTH162260DL |
ACTIVE |
-40 to 85 |
5.35 | 1ku |
SSOP (DB) | 56 |
20 | TUBE |
|
| SN74ABTH162260DLR |
ACTIVE |
-40 to 85 |
4.45 | 1ku |
SSOP (DB) | 56 |
1000 | LARGE T&R |
|
SN74ABTH162260 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| SN74ABTH162260DL |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74ABTH162260DL |
SN74ABTH162260DL |
| SN74ABTH162260DLR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74ABTH162260DLR |
SN74ABTH162260DLR |
SN74ABTH162260 应用技术支持与电子电路设计开发资源下载
- SN74ABTH162260 数据资料 dataSheet 下载.PDF
- TI 德州仪器触发器/锁存器/寄存器产品选型与价格 . xls
- Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
- Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
- TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
- Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
- CMOS Power Consumption and CPD Calculation (PDF 89 KB)
- Designing With Logic (PDF 186 KB)
- Live Insertion (PDF 150 KB)
- Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
- Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- LOGIC Pocket Data Book (PDF 6001 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- Logic Cross-Reference (PDF 2938 KB)