SN74ABT16500B 具有三态输出的 18 位通用总线收发器
These 18-bit universal bus transceivers combine D-type latches and D-type flip-flops to allow data flow in transparent, latched, and clocked modes.
Data flow in each direction is controlled by output-enable (OEAB and OEBA\), latch-enable (LEAB and LEBA), and clock (CLKAB\ and CLKBA\) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB\ is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the high-to-low transition of CLKAB\. OEAB is active-high. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high-impedance state.
Data flow for B to A is similar to that of A to B but uses OEBA\, LEBA, and CLKBA\
| SN74ABT16500B | |
| Voltage Nodes(V) | 5 |
| Vcc range(V) | 4.5 to 5.5 |
| Input Level | TTL |
| Output Level | TTL |
| Output Drive(mA) | -32/64 |
| No. of Outputs | 18 |
| Logic | True |
| Static Current | 19.5 |
| tpd max(ns) | 4.9 |
| Rating | Catalog |
| Technology Family | ABT |
SN74ABT16500B 特性
- Members of the Texas Instruments WidebusTM Family
- State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
- UBTTM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Mode
- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015
- Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
- Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 5 V, TA = 25°C
- High-Impedance State During Power Up and Power Down
- Flow-Through Architecture Optimizes PCB Layout
- Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings
SN74ABT16500B 芯片订购指南
| 器件 | 状态 | 温度 | 价格（美元） | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| 74ABT16500BDGGRE4 | ACTIVE | -40 to 85 | 2.30 | 1ku | TSSOP (DGG) | 56 | 2000 | LARGE T&R | |
| 74ABT16500BDGGRG4 | ACTIVE | -40 to 85 | 2.30 | 1ku | TSSOP (DGG) | 56 | 2000 | LARGE T&R | |
| SN74ABT16500BDGGR | ACTIVE | -40 to 85 | 2.30 | 1ku | TSSOP (DGG) | 56 | 2000 | LARGE T&R | |
| SN74ABT16500BDL | ACTIVE | -40 to 85 | 3.00 | 1ku | SSOP (DL) | 56 | 20 | TUBE | |
| SN74ABT16500BDLG4 | ACTIVE | -40 to 85 | 3.00 | 1ku | SSOP (DL) | 56 | 20 | TUBE | |
| SN74ABT16500BDLR | ACTIVE | -40 to 85 | 2.55 | 1ku | SSOP (DL) | 56 | 1000 | LARGE T&R | |
| SN74ABT16500BDLRG4 | ACTIVE | -40 to 85 | 2.55 | 1ku | SSOP (DL) | 56 | 1000 | LARGE T&R |
SN74ABT16500B 质量与无铅数据
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| 74ABT16500BDGGRE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | 74ABT16500BDGGRE4 | 74ABT16500BDGGRE4 |
| 74ABT16500BDGGRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | 74ABT16500BDGGRG4 | 74ABT16500BDGGRG4 |
| SN74ABT16500BDGGR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74ABT16500BDGGR | SN74ABT16500BDGGR |
| SN74ABT16500BDL | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74ABT16500BDL | SN74ABT16500BDL |
| SN74ABT16500BDLG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74ABT16500BDLG4 | SN74ABT16500BDLG4 |
| SN74ABT16500BDLR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74ABT16500BDLR | SN74ABT16500BDLR |
| SN74ABT16500BDLRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74ABT16500BDLRG4 | SN74ABT16500BDLRG4 |
SN74ABT16500B 应用技术支持与电子电路设计开发资源下载
- SN74ABT16500B 数据资料 dataSheet 下载.PDF
- TI 德州仪器通用总线功能产品选型与价格 . xls
- Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
- Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
- TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
- Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
- CMOS Power Consumption and CPD Calculation (PDF 89 KB)
- Designing With Logic (PDF 186 KB)
- Live Insertion (PDF 150 KB)
- Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
- Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- LOGIC Pocket Data Book (PDF 6001 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- Logic Cross-Reference (PDF 2938 KB)