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SN65LVDT9637B 双路 LVDS 接收器

This family of differential line receivers offers improved performance and features that implement the electrical characteristics of low-voltage differential signaling (LVDS). LVDS is defined in the TIA/EIA-644 standard. This improved performance represents the second generation of receiver products for this standard, providing a better overall solution for the cabled environment. This generation of products is an extension to TI's overall product portfolio and is not necessarily a replacement for older LVDS receivers.

Improved features include an input common-mode voltage range 2 V wider than the minimum required by the standard. This will allow longer cable lengths by tripling the allowable ground noise tolerance to 3 V between a driver and receiver

SN65LVDT9637B
Input Signal LVDS
Output Signal LVTTL
No. of Rx 2
Signaling Rate(Mbps) 400
Supply Voltage(s)(V) 3.3
ICC(Max)(mA) 12
Rx tpd(Typ)(ns) 4
Part-to-Part Skew(Max)(ps) 1000
Pin/Package 8SOIC
Operating Temperature Range(°C) -40 to 85
ESD HBM(kV) 15
Approx. Price (US$) 3.10 | 1ku
SN65LVDT9637B 特性
SN65LVDT9637B 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN65LVDT9637BD ACTIVE -40 to 85 1.55 | 1ku SOIC (D) | 8 75 | TUBE  
SN65LVDT9637BDG4 ACTIVE -40 to 85 1.55 | 1ku SOIC (D) | 8 75 | TUBE  
SN65LVDT9637BDR ACTIVE -40 to 85 1.30 | 1ku SOIC (D) | 8 2500 | LARGE T&R  
SN65LVDT9637BDRG4 ACTIVE -40 to 85 1.30 | 1ku SOIC (D) | 8 2500 | LARGE T&R  
SN65LVDT9637B 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN65LVDT9637BD Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDT9637BD SN65LVDT9637BD
SN65LVDT9637BDG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDT9637BDG4 SN65LVDT9637BDG4
SN65LVDT9637BDR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDT9637BDR SN65LVDT9637BDR
SN65LVDT9637BDRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDT9637BDRG4 SN65LVDT9637BDRG4
SN65LVDT9637B 应用技术支持与电子电路设计开发资源下载
  1. SN65LVDT9637B 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器LVDS PHYs选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)