SN65LVDS307 QVGA-VGA 27 位显示屏串行接口发送器

The SN65LVDS307 serializer device converts 27 parallel data inputs to one or two sub-low-voltage differential signaling (SubLVDS) serial outputs. It loads a shift register with 24 pixel bits and 3 control bits from the parallel CMOS input interface. In addition to the 27 data bits, the device adds a parity bit and two reserved bits into a 30-bit data word. Each word is latched into the device by the pixel clock (PCLK). The parity bit (odd parity) allows a receiver to detect single bit errors. The serial shift register is uploaded at 30 or 15 times the pixel-clock data rate, depending on the number of serial links used. A copy of the pixel clock is output on a separate differential output.

FPC cabling typically interconnects the SN65LVDS307 with the display

	SN65LVDS307
Number of Parallel Inputs	27
Data Throughput(MB/s)	810
Serial Data Transmitter Channels	2
Type of Line Circuit	subLVDS
Supply Voltage(s)(V)	1.8
PLL Frequency(MHz)	4 - 30
Operating Temperature Range(°C)	-40 to 85
Pin/Package	48BGA MICROSTAR JUNIOR

SN65LVDS307 特性

• FlatLink 3G Serial-Interface Technology
• Compatible With FlatLinkTM 3G Receivers Such as SN65LVDS308
• Input Supports Video Interfaces up to 24-Bit RGB Data and 3 Control Bits Received Over Two Differential Data Lines
• SubLVDS Differential Voltage Levels
• Up to 810-Mbps Data Throughput
• Three Operating Modes to Conserve Power
  • Active-Mode QVGA, 60 fps, 17.4 mW (typ)
  • Active-Mode VGA, 60 fps, 28.8 mW (typ)
  • Shutdown Mode 0.9 uW (typ)
• 1.8-V Supply Voltage
• ESD Rating > 3 kV (HBM)
• Pixel Clock Range of 4 MHz-30 MHz
• Failsafe on All CMOS Inputs
• 4-mm × 4-mm MicroStar JuniorTM uBGA(R) Package With 0,5-mm Ball Pitch
• Very Low EMI
• APPLICATIONS
  • Host-Controller to Display-Module Interface
  • Mobile Phones and Smart Phones
  • Portable Multimedia Players

SN65LVDS307 芯片订购指南

器件	状态	温度	价格	封装 | 引脚	封装数量 | 封装载体	丝印标记
SN65LVDS307ZQCR	ACTIVE	-40 to 85	1.70 | 1ku	BGA MICROSTAR JUNIOR (ZQC) | 48	2500 | LARGE T&R
SN65LVDS307ZQCT	ACTIVE	-40 to 85	1.95 | 1ku	BGA MICROSTAR JUNIOR (ZQC) | 48	250 | SMALL T&R

SN65LVDS307 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
SN65LVDS307ZQCR	Green (RoHS & no Sb/Br)	SNAGCU	Level-3-260C-168 HR	SN65LVDS307ZQCR	SN65LVDS307ZQCR
SN65LVDS307ZQCT	Green (RoHS & no Sb/Br)	SNAGCU	Level-3-260C-168 HR	SN65LVDS307ZQCT	SN65LVDS307ZQCT

SN65LVDS307 应用技术支持与电子电路设计开发资源下载

1. SN65LVDS307 数据资料 dataSheet 下载.PDF
2. TI 德州仪器FlatLink选型与价格 . xls
3. 所选封装材料的热学和电学性质 (PDF 645 KB)
4. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
5. 使用 TI 的 SN65LVDS307 收发器改善 CAN 网络安全性 (zhct033.PDF, 299 KB)
6. Isolated CAN Reference Design (PDF 48 KB)
7. Isolated RS-485 Reference Design (PDF 80 KB)
8. 无铅组件涂层的保存期评估 (PDF 1305 KB)
9. Isolated CAN EVM User's Guide (PDF 1168 KB)
10. Energy Harvesting: Solar Solutions Guide (PDF 409 KB)
11. Analog Signal Chain Guide (8.62 MB)
12. Industrial Interface IC Solutions (101 KB)

SN65LVDS307 工具与软件

培训内容	型号	软件/工具类型
通过 CAN 总线进行工业控制的演示平台	CANBUS-DEMO	硬件参考设计