SN65HVD10-EP 增强型产品 3.3V RS-485 收发器
| SN65HVD10-EP | |
| Drivers Per Package | 1 |
| Receivers Per Package | 1 |
| Supply Voltage(s)(V) | 3.3 |
| ESD(kV) | 16 |
| Temp Range(C) | -55 to 125 |
| Signaling Rate(Mbps) | 25 |
| ICC(Max)(mA) | 15.5 |
| Fail Safe | Idle, Open, Short |
| Isolated | No |
| # of TX/RX | 1 TX / 1 RX |
| Common Mode Range | -7 to 12 |
| Number of Nodes | 64 |
| Duplex | Half |
| Footprint | SN75176 |
| Comments | 3.3-V Transceiver - 25 Mbps |
| Pin/Package | 8SOIC |
| Rating | HiRel Enhanced Product |
| Fault Protection(V) | -9 to 14 |
SN65HVD10-EP 特性
- Controlled Baseline
- One Assembly/Test Site
- One Fabrication Site
- Extended Temperature Performance of Up to -40°C to 125°C and -55°C to 125°C
- Enhanced Diminishing Manufacturing Sources (DMS) Support
- Enhanced Product-Change Notification
- Qualification Pedigree(1)
- Operates With a 3.3 V Supply
- Bus-Pin ESD Protection Exceeds 16 kV HBM
- 1/8 Unit-Load Option Available (Up to 256 Nodes on the Bus)
- Optional Driver Output Transition Times for Signaling Rates of 1 Mbps, 10 Mbps, and 25 Mbps(2)
- Meets or Exceeds the Requirements of ANSI TIA/EIA-485-A
- Bus-Pin Short Circuit Protection From -7 V to 12 V
- Low-Current Standby Mode . . . 1 uA (Typ)
- Open-Circuit, Idle-Bus, and Shorted-Bus Failsafe Receiver
- Thermal Shutdown Protection
- Glitch-Free Power-Up and Power-Down Protection for Hot-Plugging Applications
- SN75176 Footprint
- APPLICATIONS
- Digital Motor Control
SN65HVD10-EP 芯片订购指南
| 器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| SN65HVD10MDREP | ACTIVE | -55 to 125 | 4.40 | 100u | SOIC (D) | 8 | 2500 | LARGE T&R | |
| SN65HVD10QDREP | ACTIVE | -40 to 125 | 4.40 | 100u | SOIC (D) | 8 | 2500 | LARGE T&R | |
| V62/05604-01XE | ACTIVE | -40 to 125 | 4.40 | 100u | SOIC (D) | 8 | 2500 | LARGE T&R | |
| V62/05604-04XE | ACTIVE | -55 to 125 | 4.40 | 100u | SOIC (D) | 8 | 2500 | LARGE T&R |
SN65HVD10-EP 质量与无铅数据
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| SN65HVD10MDREP | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN65HVD10MDREP | SN65HVD10MDREP |
| SN65HVD10QDREP | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN65HVD10QDREP | SN65HVD10QDREP |
| V62/05604-01XE | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | V62/05604-01XE | V62/05604-01XE |
| V62/05604-04XE | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | V62/05604-04XE | V62/05604-04XE |
SN65HVD10-EP 应用技术支持与电子电路设计开发资源下载
- SN65HVD10-EP 数据资料 dataSheet 下载.PDF
- TI 德州仪器RS-485选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)