SN55LVDS32 四路 LVDS 发送器

The SN55LVDS32, SN65LVDS32, SN65LVDS3486, and SN65LVDS9637 are differential line receivers that implement the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as EIA/TIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the four differential receivers provides a valid logical output state with a ±100-mV differential input voltage within the input common-mode voltage range. The input common-mode voltage range allows 1 V of ground potential difference between two LVDS nodes.

The intended application of these devices and signaling technique is both point-to-point and multidrop (one driver and multiple receivers) data transmission over controlled impedance media of approximately 100 .

	SN55LVDS32
Input Signal	LVDS
Output Signal	LVTTL
No. of Rx	4
Signaling Rate(Mbps)	100
Supply Voltage(s)(V)	3.3
ICC(Max)(mA)	18
Rx tpd(Typ)(ns)	2.3
Pin/Package	16CDIP, 16CFP, 20LCCC
Operating Temperature Range(°C)	-55 to 125
ESD HBM(kV)	8

SN55LVDS32 特性

• Meet or Exceed the Requirements of ANSI TIA/EIA-644 Standard
• Operate With a Single 3.3-V Supply
• Designed for Signaling Rates of up to100 Mbps
• Differential Input Thresholds ±100 mV Max
• Typical Propagation Delay Time of 2.1 ns
• Power Dissipation 60 mW Typical Per Receiver at Maximum Data Rate
• Bus-Terminal ESD Protection Exceeds 8 kV
• Low-Voltage TTL (LVTTL) Logic Output Levels
• Pin Compatible With AM26LS32, MC3486, and uA9637
• Open-Circuit Fail-Safe
• Cold Sparing for Space and High Reliability Applications Requiring Redundancy

SN55LVDS32 芯片订购指南

器件	状态	温度	价格	封装 | 引脚	封装数量 | 封装载体	丝印标记
SN55LVDS32W	ACTIVE	-55 to 125	16.83 | 100u	CFP (W) | 16	1 | TUBE
SNJ55LVDS32FK	ACTIVE	-55 to 125	22.55 | 100u	LCCC (FK) | 20	1 | TUBE
SNJ55LVDS32J	ACTIVE	-55 to 125	16.50 | 100u	CDIP (J) | 16	1 | TUBE
SNJ55LVDS32W	ACTIVE	-55 to 125	20.54 | 100u	CFP (W) | 16	1 | TUBE

SN55LVDS32 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
SN55LVDS32W	TBD	A42	N/A for Pkg Type	SN55LVDS32W	SN55LVDS32W
SNJ55LVDS32FK	TBD	POST-PLATE	N/A for Pkg Type	SNJ55LVDS32FK	SNJ55LVDS32FK
SNJ55LVDS32J	TBD	A42	N/A for Pkg Type	SNJ55LVDS32J	SNJ55LVDS32J
SNJ55LVDS32W	TBD	A42	N/A for Pkg Type	SNJ55LVDS32W	SNJ55LVDS32W

SN55LVDS32 应用技术支持与电子电路设计开发资源下载

1. SN55LVDS32 数据资料 dataSheet 下载.PDF
2. TI 德州仪器LVDS PHYs选型与价格 . xls
3. 所选封装材料的热学和电学性质 (PDF 645 KB)
4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
6. 接口选择指南 (Rev. D) (PDF 2994 KB)
7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
9. Isolated RS-485 Reference Design (PDF 80 KB)
10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
11. Analog Signal Chain Guide (8.62 MB)
12. Industrial Interface IC Solutions (101 KB)