SN54ABT18245A 具有 18 位总线收发器的扫描测试设备
The 'ABT18245A scan test devices with 18-bit bus transceivers are members of the Texas Instruments SCOPETM testability integrated-
circuit family. This family of devices supports IEEE Standard 1149.1-1990 boundary scan to facilitate testing of complex circuit-board assemblies. Scan access to the test circuitry is accomplished via the 4-wire test access port (TAP) interface.
In the normal mode, these devices are 18-bit noninverting bus transceivers. They can be used either as two 9-bit transceivers or one 18-bit transceiver. The test circuitry can be activated by the TAP to take snapshot samples of the data appearing at the device pins or to perform a self-test on the boundary-test cells. Activating the TAP in the normal mode does not affect the functional operation of the SCOPETM bus transceivers
|
SN54ABT18245A |
Voltage Nodes(V) |
5 |
Vcc range(V) |
4.5 to 5.5 |
Input Level |
TTL |
Logic |
True |
No. of Outputs |
18 |
Output Drive(mA) |
-24/48 |
tpd max(ns) |
5.8 |
Output Level |
TTL |
Static Current |
38 |
Rating |
Military |
Technology Family |
ABT |
SN54ABT18245A 特性
- Members of the Texas Instruments SCOPETM Family of Testability Products
- Members of the Texas Instruments WidebusTM Family
- Compatible With the IEEE Standard 1149.1-1990 (JTAG) Test Access Port and Boundary-Scan Architecture
- SCOPETM Instruction Set
- IEEE Standard 1149.1-1990 Required Instructions, CLAMP and HIGHZ
- Parallel-Signature Analysis at Inputs
- Pseudo-Random Pattern Generation From Outputs
- Sample Inputs/Toggle Outputs
- Binary Count From Outputs
- Device Identification
- Even-Parity Opcodes
- State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
- Packaged in Plastic Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Packages
SN54ABT18245A 芯片订购指南
器件 |
状态 |
温度 |
价格(美元) |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
5962-9460102QXA |
ACTIVE |
-55 to 125 |
51.35 | 1ku |
CFP (WD) | 56 |
1 | TUBE |
|
SNJ54ABT18245AWD |
ACTIVE |
-55 to 125 |
51.35 | 1ku |
CFP (WD) | 56 |
1 | TUBE |
|
SN54ABT18245A 质量与无铅数据
器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
5962-9460102QXA |
TBD |
A42 |
N/A for Pkg Type |
5962-9460102QXA |
5962-9460102QXA |
SNJ54ABT18245AWD |
TBD |
A42 |
N/A for Pkg Type |
SNJ54ABT18245AWD |
SNJ54ABT18245AWD |
SN54ABT18245A 应用技术支持与电子电路设计开发资源下载
- TI 德州仪器特殊逻辑产品选型与价格 . xls
- Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
- Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
- TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
- Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
- CMOS Power Consumption and CPD Calculation (PDF 89 KB)
- Designing With Logic (PDF 186 KB)
- Live Insertion (PDF 150 KB)
- Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
- Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- LOGIC Pocket Data Book (PDF 6001 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- Logic Cross-Reference (PDF 2938 KB)