PT6983 3.3V/1.8V 9.5A 输出 12V 输入的双输出 ISR

PT6983 描述

The PT6980 ExcaliburTM series of power modules are dual output integrated switching regulators (ISRs) specifically designed to power mixed signal ICs. Operating from a 12-V input bus, the dual output provides power for both the digital I/O logic and a DSP core from a singl module. Both output voltages are internally sequenced during power-up and power-down to comply with the requirements of the latest DSP chips. Each output is independently adjustable or can be set to at least one alternative bus voltage with a simple pin-strap. The modules are made available in a space-saving solderable case. The features include output current limit and short-circuit protection.

	PT6981	PT6982	PT6983	PT6984
Vin(Min)(V)	10.8	10.8	10.8	10.8
Vin(Max)(V)	13.2	13.2	13.2	13.2
Vout(Min)(V)	2.5	3.3	3.3	3.3
Vout(Max)(V)	2.5	3.3	3.3	3.3
Vout2(Min)(V)	1.8	2.5	1.8	1.2
Vout2(Max)(V)	1.8	2.5	1.8	1.2
Iout(Max)(A)	10.5	10.5	9.5	8.6
Iout2(A)	10.5	10.5	9.5	8.6
Pin/Package	23SIP MODULE	23SIP MODULE	23SIP MODULE	23SIP MODULE
Regulated Outputs(#)	2	2	2	2

PT6983 特性

• Dual Outputs (See Ordering Information)
• Ideal Power Source for DSPs
• 12V Input
• Outputs Adjustable
• Remote Sensing (Vo1 and Vo2)
• Standby Function
• Soft-Start
• Internal Sequencing
• Short Circuit Protection
• 23-pin Space-Saving Package
• Solderable Copper Case

PT6983 芯片订购指南

器件	状态	价格（美元）	封装 | 引脚	封装数量 | 封装载体	丝印标记
PT6983A	ACTIVE	39.35 | 1ku	SIP MODULE (ENF) | 23	10 | TIW TRAY
PT6983C	ACTIVE	39.35 | 1ku	SIP MODULE (ENG) | 23	10 | TIW TRAY

PT6983 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
PT6983A	TBD	Call TI	Level-1-215C-UNLIM	PT6983A	PT6983A
PT6983C	TBD	Call TI	Level-3-215C-168HRS	PT6983C	PT6983C

PT6983 应用技术支持与电子电路设计开发资源下载

1. PT6983 数据资料 dataSheet 下载.PDF
2. TI 德州仪器插入电源模块产品选型与价格 . xls
3. 使用新电源模块改进表面贴装可制造性 (PDF 1747 KB)
4. QFN Layout Guidelines (PDF 1279 KB)
5. 笔记本电脑指南 (Rev. A) (PDF 2774 KB)
6. 全面认识开关型电源中的BUCK-BOOST功率级 (Rev. A) (PDF 2206 KB)
7. PowerPADTM Made Easy (PDF 57 KB)
8. 标准线性产品交叉参考 (Rev. D) (PDF 1058 KB)
9. 模数规格和性能特性术语表 (Rev. A) (PDF 1993 KB)
10. 所选封装材料的热学和电学性质 (PDF 645 KB)
11. 高速数据转换 (PDF 1967 KB)