首页 > TI 德州仪器 > 接口 > PCI

PCI2250 32 位 33MHz PCI 至 PCI 桥接器压缩 PCI 热插拔 4 主控方

The Texas Instruments PCI2250 PCI-to-PCI bridge provides a high performance connection path between two peripheral component interconnect (PCI) buses. Transactions occur between masters on one PCI bus and targets on another PCI bus, and the PCI2250 allows bridged transactions to occur concurrently on both buses. The bridge supports burst-mode transfers to maximize data throughput, and the two bus traffic paths through the bridge act independently.

The PCI2250 bridge is compliant with the PCI Local Bus Specification, and can be used to overcome the electrical loading limits of 10 devices per PCI bus and one PCI device per expansion slot by creating hierarchical buses. The PCI2250 provides two-tier internal arbitration for up to four secondary bus masters and may be implemented with an external secondary PCI bus arbiter

PCI2250
Intel-Compatible Part Number 21152ab
Speed(MHz) 33
Expansion Interface(bits) 32
Hot-Swap Friendly
Supply Voltage(s)(V) 3.3, 5
Operating Temperature Range(C) 0 to 70
Pin/Package 160QFP, 176LQFP
Approx. Price (US$) 6.10 | 1ku
PCI2250 特性
PCI2250 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
PCI2250PCM ACTIVE 0 to 70 6.10 | 1ku QFP (PCM) | 160 24 | JEDEC TRAY (10+1)  
PCI2250PCMG4 ACTIVE 6.10 | 1ku QFP (PCM) | 160 24 | JEDEC TRAY (10+1)  
PCI2250PGF ACTIVE 0 to 70 6.10 | 1ku LQFP (PGF) | 176 40 | JEDEC TRAY (10+1)  
PCI2250PGFG4 ACTIVE 0 to 70 6.10 | 1ku LQFP (PGF) | 176 40 | JEDEC TRAY (10+1)  
PCI2250 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
PCI2250PCM Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR PCI2250PCM PCI2250PCM
PCI2250PCMG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR PCI2250PCMG4 PCI2250PCMG4
PCI2250PGF Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR PCI2250PGF PCI2250PGF
PCI2250PGFG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR PCI2250PGFG4 PCI2250PGFG4
PCI2250 应用技术支持与电子电路设计开发资源下载
  1. PCI2250 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器PCI选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)
PCI2250 工具和软件
培训内容 型号 软件/工具类型
PCI2250 评估模块 PCI2250EVM 开发电路板/EVM