首页 > TI 德州仪器 > 放大器和线性器件 > 运算放大器

LMV324 四路低压轨至轨输出运算放大器

The LMV321, LMV358, and LMV324/LMV324S are single, dual, and quad low-voltage (2.7 V to 5.5 V) operational amplifiers with rail-to-rail output swing. The LMV324S, which is a variation of the standard LMV324, includes a power-saving shutdown feature that reduces supply current to a maximum of 5 uA per channel when the amplifiers are not needed. Channels 1 and 2 together are put in shutdown, as are channels 3 and 4. While in shutdown, the outputs actively are pulled low.

The LMV321, LMV358, LMV324, and LMV324S are the most cost-effective solutions for applications where low-voltage operation, space saving, and low cost are needed. These amplifiers were designed specifically for low-voltage (2.7 V to 5 V) operation, with performance specifications meeting or exceeding the LM358 and LM324 devices that operate from 5 V to 30 V. Additional features of the LMV3xx devices are a common-mode input voltage range that includes ground, 1-MHz unity-gain bandwidth, and 1-V/us slew rate.

The LMV321 is available in the ultra-small DCK (SC-70) package, which is approximately one-half the size of the DBV (SOT-23) package. This package saves space on printed circuit boards and enables the design of small portable electronic devices. It also allows the designer to place the device closer to the signal source to reduce noise pickup and increase signal integrity


LMV324
Iq per channel(Max)(mA) 0.17
VIO (25 deg C)(Max)(mV) 7
CMRR(Min)(dB) 50
Vn at 1kHz(Typ)(nV/rtHz) 39
Rail-Rail Out
IIB(Max)(pA) 250000
Slew Rate(Typ)(V/us) 1
GBW(Typ)(MHz) 1
Spec'd at Vs(V) 2.7, 5
VIO (Full Range)(Max)(mV) 9
Vs(Min)(V) 2.7
Vs(Max)(V) 5.5
Pin/Package 14SOIC, 14TSSOP
Vio(Max)(mV) 9
Supply Voltage 5(V) Yes
Offset Drift(Typ)(uV/C) 5
IQ Per Amp (+/-)(Max)(mA) 0.17
Offset Voltage (+/-)(Max)(mV) 7
Number of Channels 4
Approx. Price (US$) 0.30 | 1ku
Operating Temperature Range(C) -40 to 125,-40 to 85
Total Supply Voltage (V)(Min)(+5V=5, +/-5V=10) 2.7
Total Supply Voltage (V)(Max)(+5V=5, +/-5V=10) 5.5
LMV324 特性
LMV324 芯片订购指南
器件 状态 温度 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
LMV324ID ACTIVE -40 to 85 0.36 | 1ku SOIC (D) | 14 50 | TUBE  
LMV324IDG4 ACTIVE -40 to 85 0.36 | 1ku SOIC (D) | 14 50 | TUBE  
LMV324IDR ACTIVE -40 to 85 0.30 | 1ku SOIC (D) | 14 2500 | LARGE T&R  
LMV324IDRG4 ACTIVE -40 to 85 0.30 | 1ku SOIC (D) | 14 2500  
LMV324IPWR ACTIVE -40 to 85 0.30 | 1ku TSSOP (PW) | 14 2000 | LARGE T&R  
LMV324IPWRE ACTIVE -40 to 85 0.30 | 1ku TSSOP (PW) | 14 2000  
LMV324IPWRG4 ACTIVE -40 to 85 0.30 | 1ku TSSOP (PW) | 14 2000  
LMV324QD ACTIVE -40 to 125 0.39 | 1ku SOIC (D) | 14 50 | TUBE  
LMV324QDG4 ACTIVE -40 to 125 0.39 | 1ku SOIC (D) | 14 50 | TUBE  
LMV324QDR ACTIVE -40 to 125 0.33 | 1ku SOIC (D) | 14 2500 | LARGE T&R  
LMV324QDRG4 ACTIVE -40 to 125 0.33 | 1ku SOIC (D) | 14 2500 | LARGE T&R  
LMV324QPW ACTIVE -40 to 125 0.39 | 1ku TSSOP (PW) | 14 90 | TUBE  
LMV324QPWE4 ACTIVE -40 to 125 0.39 | 1ku TSSOP (PW) | 14 90 | TUBE  
LMV324QPWG4 ACTIVE -40 to 125 0.39 | 1ku TSSOP (PW) | 14 90 | TUBE  
LMV324QPWR ACTIVE -40 to 125 0.33 | 1ku TSSOP (PW) | 14 2000 | LARGE T&R  
LMV324QPWRG4 ACTIVE -40 to 125 0.33 | 1ku TSSOP (PW) | 14 2000 | LARGE T&R  
LMV324 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
LMV324ID Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324ID LMV324ID
LMV324IDG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324IDG4 LMV324IDG4
LMV324IDR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324IDR LMV324IDR
LMV324IDRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324IDRG4 LMV324IDRG4
LMV324IPWR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324IPWR LMV324IPWR
LMV324IPWRE Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324IPWRE LMV324IPWRE
LMV324IPWRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324IPWRG4 LMV324IPWRG4
LMV324QD Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324QD LMV324QD
LMV324QDG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324QDG4 LMV324QDG4
LMV324QDR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324QDR LMV324QDR
LMV324QDRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324QDRG4 LMV324QDRG4
LMV324QPW Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324QPW LMV324QPW
LMV324QPWE4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324QPWE4 LMV324QPWE4
LMV324QPWG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324QPWG4 LMV324QPWG4
LMV324QPWR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324QPWR LMV324QPWR
LMV324QPWRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324QPWRG4 LMV324QPWRG4
LMV324 应用技术支持与电子电路设计开发资源下载
  1. LMV324 数据资料 dataSheet 下载.PDF
  2. TI 德州仪标准线性放大器产品选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 高速数据转换 (PDF 1967 KB)
  5. 在 PSPICE 中使用德州仪器 (TI) SPICE 模型 (zhca088.HTM, 8 KB)
  6. PowerPADTM Thermally Enhanced Package (slma002g.HTM, 8 KB)
  7. 运算放大器的单电源操作 (PDF 2174 KB)
  8. Tuning in Amplifiers (PDF 44 KB)
  9. Op Amp Performance Analysis (PDF 76 KB)
  10. An Error Analysis of the ISO102 in a Small Signal Measuring Application (PDF 29 KB)
  11. Level Shifting Signals with Differential Amplifiers (PDF 23 KB)
  12. Operational Amplifier Macromodels: A Comparison (PDF 59 KB)