DCH010505S Miniature, 2W Isolated Unregulated DC/DC Converters
DCH010505S 描述
The DCH01 series is a family of miniature, 1-W, 3-kV isolated DC/DC converters. Featured in an industry standard SIP-7 footprint, the DCH01 series requires minimal external components, reducing board space. The DCH01 series provides both single and dual split-supply outputs.
The use of a highly integrated package design resultsin highly reliable products with high power densities. High performance and small size makes the DCH01 suitable for a wide range of applications including signal chain applications and ground loop elimination
|
DCH010505D |
DCH010505S |
DCH010512D |
DCH010512S |
DCH010515D |
DCH010515S |
| Vin(Min)(V) |
4.5 |
4.5 |
4.5 |
4.5 |
4.5 |
4.5 |
| Vin(Max)(V) |
5.5 |
5.5 |
5.5 |
5.5 |
5.5 |
5.5 |
| Preset Vout(V) |
5 |
5 |
12 |
12 |
15 |
15 |
| Vout(Min)(V) |
4.5 |
4.5 |
11.4 |
11.4 |
14.25 |
14.25 |
| Vout(Max)(V) |
5.5 |
5.5 |
12.6 |
12.6 |
15.75 |
15.75 |
| Iout(Max)(A) |
0.1 |
0.2 |
0.042 |
0.083 |
0.033 |
0.067 |
| Pin/Package |
5SIP MODULE |
4SIP MODULE |
5SIP MODULE |
4SIP MODULE |
5SIP MODULE |
4SIP MODULE |
| Iout2(A) |
0.1 |
|
0.042 |
|
0.033 |
|
| Vout2(Min)(V) |
-4.5 |
|
-11.4 |
|
-14.25 |
|
| Vout2(Max)(V) |
-5.5 |
|
-12.6 |
|
-15.75 |
|
| Regulated Outputs(#) |
2 |
1 |
2 |
1 |
2 |
1 |
DCH010505S 特性
- Up To 78% Efficiency
- 3-kVDC Isolation
- UL60950 Certified Product
- Industry Standard Footprint
- JEDEC SIP-7 Package
- APPLICATIONS
- Point-of-Use Power Conversion
- Ground Loop Elimination
- Data Acquisition
- Industrial Control and Instrumentation
- Test Equipment
DCH010505S 芯片订购指南
| 器件 |
状态 |
温度 (oC) |
价格（美元） |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| DCH010505SN7 |
ACTIVE |
-40 to 85 |
4.25 | 1ku |
SIP MODULE (EDJ) | 4 |
70 | TIW TRAY |
|
DCH010505S 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| DCH010505SN7 |
Pb-Free (RoHS) |
Call TI |
N/A for Pkg Type |
DCH010505SN7 |
DCH010505SN7 |
DCH010505S 应用技术支持与电子电路设计开发资源下载
- DCH010505S 数据资料 dataSheet 下载.PDF
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- 模数规格和性能特性术语表 (Rev. A) (PDF 1993 KB)
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 高速数据转换 (PDF 1967 KB)
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