CY74FCT573T 具有三态输出的八路透明 D 类锁存器
The \x92FCT573T devices consist of eight latches with 3-state outputs for bus-organized applications. When the latch-enable (LE) input is high, the flip-flops appear transparent to the data. Data that meets the required setup times are latched when LE transitions from high to low. Data appears on the bus when the output-enable (OE\) input is low. When OE\ is high, the bus output is in the high-impedance state. In this mode, data can be entered into the latches. The \x92FCT573T devices are identical to the \x92FCT373T devices, except for the flow-through pinout of the \x92FCT573T, which simplifies board design.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down
CY74FCT573T 特性
- Function and Pinout Compatible With FCT and F Logic
- Reduced VOH(Typically = 3.3 V) Versions of Equivalent FCT Functions
- Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
- Ioff Supports Partial-Power-Down Mode Operation
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- Matched Rise and Fall Times
- Fully Compatible With TTL Input and Output Logic Levels
- 3-State Outputs
- CY54FCT573T
- 32-mA Output Sink Current
- 12-mA Output Source Current
- CY74FCT573T
- 64-mA Output Sink Current
- 32-mA Output Source Current
CY74FCT573T 芯片订购指南
| 器件 |
状态 |
温度 |
价格（美元） |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| CY74FCT573TQCT |
ACTIVE |
-40 to 85 |
0.90 | 1ku |
SSOP/QSOP (DBQ) | 20 |
2500 | LARGE T&R |
|
| CY74FCT573TQCTE4 |
ACTIVE |
-40 to 85 |
0.90 | 1ku |
SSOP/QSOP (DBQ) | 20 |
2500 | LARGE T&R |
|
| CY74FCT573TQCTG4 |
ACTIVE |
-40 to 85 |
0.90 | 1ku |
SSOP/QSOP (DBQ) | 20 |
2500 | LARGE T&R |
|
| CY74FCT573TSOC |
ACTIVE |
-40 to 85 |
0.48 | 1ku |
SOIC (DW) | 20 |
25 | TUBE |
|
| CY74FCT573TSOCE4 |
ACTIVE |
-40 to 85 |
0.48 | 1ku |
SOIC (DW) | 20 |
25 | TUBE |
|
| CY74FCT573TSOCG4 |
ACTIVE |
-40 to 85 |
0.48 | 1ku |
SOIC (DW) | 20 |
25 | TUBE |
|
| CY74FCT573TSOCT |
ACTIVE |
-40 to 85 |
0.85 | 1ku |
SOIC (DW) | 20 |
2000 | LARGE T&R |
|
| CY74FCT573TSOCTE4 |
ACTIVE |
-40 to 85 |
0.85 | 1ku |
SOIC (DW) | 20 |
2000 | LARGE T&R |
|
| CY74FCT573TSOCTG4 |
ACTIVE |
-40 to 85 |
0.85 | 1ku |
SOIC (DW) | 20 |
2000 | LARGE T&R |
|
CY74FCT573T 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| CY74FCT573TQCT |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
CY74FCT573TQCT |
CY74FCT573TQCT |
| CY74FCT573TQCTE4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
CY74FCT573TQCTE4 |
CY74FCT573TQCTE4 |
| CY74FCT573TQCTG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
CY74FCT573TQCTG4 |
CY74FCT573TQCTG4 |
| CY74FCT573TSOC |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CY74FCT573TSOC |
CY74FCT573TSOC |
| CY74FCT573TSOCE4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CY74FCT573TSOCE4 |
CY74FCT573TSOCE4 |
| CY74FCT573TSOCG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CY74FCT573TSOCG4 |
CY74FCT573TSOCG4 |
| CY74FCT573TSOCT |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CY74FCT573TSOCT |
CY74FCT573TSOCT |
| CY74FCT573TSOCTE4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CY74FCT573TSOCTE4 |
CY74FCT573TSOCTE4 |
| CY74FCT573TSOCTG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CY74FCT573TSOCTG4 |
CY74FCT573TSOCTG4 |
CY74FCT573T 应用技术支持与电子电路设计开发资源下载
- CY74FCT573T 数据资料 dataSheet 下载.PDF
- TI 德州仪器触发器/锁存器/寄存器产品选型与价格 . xls
- Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
- Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
- TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
- Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
- CMOS Power Consumption and CPD Calculation (PDF 89 KB)
- Designing With Logic (PDF 186 KB)
- Live Insertion (PDF 150 KB)
- Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
- Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- LOGIC Pocket Data Book (PDF 6001 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- Logic Cross-Reference (PDF 2938 KB)