CD74HCT564 具有三态输出的高速 CMOS 逻辑八路上升沿反向 D 类触发器
The ’HC534, ’HCT534, ’HC564, and ’HCT564 are high speed Octal D-Type Flip-Flops manufactured with silicon gate CMOS technology. They possess the low power consumption of stan-dard CMOS integrated circuits, as well as the ability to drive 15 LSTTL loads. Due to the large output drive capability and the three-state feature, these devices are ideally suited for interfacing with bus lines in a bus organized system. The two types are functionally identical and differ only in their pinout arrangements.
The ’HC534, ’HCT534, ’HC564, and ’HCT564 are positive edge triggered flip-flops. Data at the D inputs, meeting the setup and hold time requirements, are inverted and trans-ferred to the Q outputs on the positive going transition of the CLOCK input
CD74HCT564 特性
- Buffered Inputs
- Common Three-State Output-Enable Control
- Three-State Outputs
- Bus Line Driving Capability
- Typical Propagation Delay = 13ns at VCC = 5V, CL = 15pF, TA = 25°C (Clock to Output)
- Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
- Wide Operating Temperature Range . . . -55°C to 125°C
- Balanced Propagation Delay and Transition Times
- Significant Power Reduction Compared to LSTTL Logic ICs
- HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V
- HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility, VIL = 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1uA at VOL, VOH
CD74HCT564 芯片订购指南
器件 |
状态 |
温度 |
价格(美元) |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
CD74HCT564E |
ACTIVE |
-55 to 125 |
0.60 | 1ku |
PDIP (N) | 20 |
20 | TUBE |
|
CD74HCT564EE4 |
ACTIVE |
-55 to 125 |
0.60 | 1ku |
PDIP (N) | 20 |
20 | TUBE |
|
CD74HCT564M |
ACTIVE |
-55 to 125 |
0.65 | 1ku |
SOIC (DW) | 20 |
25 | TUBE |
|
CD74HCT564M96 |
ACTIVE |
-55 to 125 |
0.55 | 1ku |
SOIC (DW) | 20 |
2000 | LARGE T&R |
|
CD74HCT564M96E4 |
ACTIVE |
-55 to 125 |
0.55 | 1ku |
SOIC (DW) | 20 |
2000 | LARGE T&R |
|
CD74HCT564M96G4 |
ACTIVE |
-55 to 125 |
0.55 | 1ku |
SOIC (DW) | 20 |
2000 | LARGE T&R |
|
CD74HCT564ME4 |
ACTIVE |
-55 to 125 |
0.65 | 1ku |
SOIC (DW) | 20 |
25 | TUBE |
|
CD74HCT564MG4 |
ACTIVE |
-55 to 125 |
0.65 | 1ku |
SOIC (DW) | 20 |
25 | TUBE |
|
CD74HCT564 质量与无铅数据
器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
CD74HCT564E |
Pb-Free (RoHS) |
CU NIPDAU |
N/A for Pkg Type |
CD74HCT564E |
CD74HCT564E |
CD74HCT564EE4 |
Pb-Free (RoHS) |
CU NIPDAU |
N/A for Pkg Type |
CD74HCT564EE4 |
CD74HCT564EE4 |
CD74HCT564M |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CD74HCT564M |
CD74HCT564M |
CD74HCT564M96 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CD74HCT564M96 |
CD74HCT564M96 |
CD74HCT564M96E4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CD74HCT564M96E4 |
CD74HCT564M96E4 |
CD74HCT564M96G4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CD74HCT564M96G4 |
CD74HCT564M96G4 |
CD74HCT564ME4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CD74HCT564ME4 |
CD74HCT564ME4 |
CD74HCT564MG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
CD74HCT564MG4 |
CD74HCT564MG4 |
CD74HCT564 应用技术支持与电子电路设计开发资源下载
- CD74HCT564 数据资料 dataSheet 下载.PDF
- TI 德州仪器触发器/锁存器/寄存器产品选型与价格 . xls
- Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
- Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
- TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
- Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
- CMOS Power Consumption and CPD Calculation (PDF 89 KB)
- Designing With Logic (PDF 186 KB)
- Live Insertion (PDF 150 KB)
- Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
- Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- LOGIC Pocket Data Book (PDF 6001 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- Logic Cross-Reference (PDF 2938 KB)