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BUF602 高速闭环缓冲器

The BUF602 is a closed-loop buffer recommended for a wide range of applications. Its wide bandwidth (1000MHz) and high slew rate (8000V/us) make it ideal for buffering very high-frequency signals. For AC-coupled applications, an optional mid-point reference (VREF) is provided, reducing the number of external components required and the necessary supply current to provide that reference.

The BUF602 is available in a standard SO-8 surface-mount package and in an SOT23-5 where a smaller footprint is needed

BUF602
Iq per channel (Max) (mA) 5.8
Slew Rate (Typ) (V/us) 8000
GBW (Typ) (MHz) 1200
Io (Typ) (mA) 60
Vs (Min) (V) 2.8
Vs (Max) (V) 12.6
Number of Channels 1
Pin/Package 5SOT-23, 8SOIC
Acl, min stable gain (V/V) 1
BW @ Acl (MHz) 1200
Vio (Max) (mV) 30
Available Channels S
Vn at Flatband (Typ) (nV/rtHz) 4.8
Approx. Price (US$) 0.85 | 1ku
Iib (Max) (nA) 7
Operating Temperature Range (C) -45 to 85
Rating Catalog
BUF602 特性
BUF602 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
BUF602ID ACTIVE -45 to 85 1.00 | 1ku SOIC (D) | 8 75 | TUBE  
BUF602IDBVR ACTIVE -45 to 85 0.85 | 1ku SOT-23 (DBV) | 5 3000 | LARGE T&R  
BUF602IDBVRG4 ACTIVE -45 to 85 0.85 | 1ku SOT-23 (DBV) | 5 3000 | LARGE T&R  
BUF602IDBVT ACTIVE -45 to 85 1.00 | 1ku SOT-23 (DBV) | 5 250 | SMALL T&R  
BUF602IDBVTG4 ACTIVE -45 to 85 1.00 | 1ku SOT-23 (DBV) | 5 250 | SMALL T&R  
BUF602IDG4 ACTIVE -45 to 85 1.00 | 1ku SOIC (D) | 8 75 | TUBE  
BUF602IDR ACTIVE -45 to 85 0.85 | 1ku SOIC (D) | 8 2500 | LARGE T&R  
BUF602IDRG4 ACTIVE -45 to 85 0.85 | 1ku SOIC (D) | 8 2500 | LARGE T&R  
BUF602 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
BUF602ID Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BUF602ID BUF602ID
BUF602IDBVR Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BUF602IDBVR BUF602IDBVR
BUF602IDBVRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BUF602IDBVRG4 BUF602IDBVRG4
BUF602IDBVT Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BUF602IDBVT BUF602IDBVT
BUF602IDBVTG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BUF602IDBVTG4 BUF602IDBVTG4
BUF602IDG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BUF602IDG4 BUF602IDG4
BUF602IDR Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BUF602IDR BUF602IDR
BUF602IDRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BUF602IDRG4 BUF602IDRG4
BUF602 应用技术支持与电子电路设计开发资源下载
  1. BUF602 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器视频功能产品选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 高速数据转换 (PDF 1967 KB)
  5. 使您的仪器放大器设计达到最佳效果 (zhct011.PDF, 897 KB)
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  7. Driving High-Speed ADCs: Circuit Topologies and System-Level Parameter (slaa416a.HTM, 9 KB)
  8. A Numerical Solution to an Analog Problem (sboa124.HTM, 8 KB)
  9. TI 工业自动电机控制/驱动器解决方案 2011 (Rev. B) (PDF 1322 KB)
  10. 在 PSPICE 中使用德州仪器 (TI) SPICE 模型 (zhca088.HTM, 8 KB)
  11. PowerPADTM Thermally Enhanced Package (slma002g.HTM, 8 KB)
  12. 运算放大器的单电源操作 (PDF 2174 KB)
  13. Tuning in Amplifiers (PDF 44 KB)
  14. Op Amp Performance Analysis (PDF 76 KB)
  15. An Error Analysis of the ISO102 in a Small Signal Measuring Application (PDF 29 KB)
  16. Level Shifting Signals with Differential Amplifiers (PDF 23 KB)
  17. Operational Amplifier Macromodels: A Comparison (PDF 59 KB)
BUF602 工具与软件
培训内容 型号 软件/工具类型
BUF602 评估模块 BUF602EVM 开发电路板/EVM