AM26LV32 低电压高速四路差动线路驱动器
The AM26LV32, BiCMOS, quadruple, differential line receiver with 3-state outputs is designed to be similar to TIA/EIA-422-B and ITU Recommendation V.11 receivers with reduced common-mode voltage range due to reduced supply voltage.
The device is optimized for balanced bus transmission at switching rates up to 32 MHz. The enable function is common to all four receivers and offers a choice of active-high or active-low inputs. The 3-state outputs permit connection directly to a bus-organized system. Each device features receiver high input impedance and input hysteresis for increased noise immunity, and input sensitivity of ±200 mV over a common-mode input voltage range from -0.3 V to 5.5 V. When the inputs are open circuited, the outputs are in the high logic state
|
AM26LV32 |
| Temp Range(C) |
-40 to 85, 0 to 70 |
| Receivers Per Package |
4 |
| Supply Voltage(s)(V) |
3.3 |
| ICC(Max)(mA) |
17 |
| Operating Temperature Range(C) |
-40 to 85,0 to 70 |
| Footprint |
AM26LS32 |
| Pin/Package |
16SO, 16SOIC |
| Rating |
Catalog |
AM26LV32 特性
- Switching Rates up to 32 MHz
- Operates from a Single 3.3-V Supply
- Ultra-Low Power Dissipation...27 mW Typ
- Open-Circuit, Short-Circuit, and Terminated Fail-Safe
- -0.3-V to 5.5-V Common-Mode Range With ±200 mV Sensitivity
- Accepts 5-V Logic Inputs With a 3.3-V VCC
- Input Hysteresis...50 mV Typ
- 235 mW With Four Receivers at 32 MHz
- Pin-to-Pin Compatible With AM26C32, AM26LS32, and MB570
AM26LV32 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| AM26LV32CD |
ACTIVE |
0 to 70 |
0.65 | 1ku |
SOIC (D) | 16 |
40 | TUBE |
|
| AM26LV32CDE4 |
ACTIVE |
0 to 70 |
0.65 | 1ku |
SOIC (D) | 16 |
40 | TUBE |
|
| AM26LV32CDG4 |
ACTIVE |
0 to 70 |
0.65 | 1ku |
SOIC (D) | 16 |
40 | TUBE |
|
| AM26LV32CDR |
ACTIVE |
0 to 70 |
0.55 | 1ku |
SOIC (D) | 16 |
2500 | LARGE T&R |
|
| AM26LV32CDRE4 |
ACTIVE |
0 to 70 |
0.55 | 1ku |
SOIC (D) | 16 |
2500 | LARGE T&R |
|
| AM26LV32CDRG4 |
ACTIVE |
0 to 70 |
0.55 | 1ku |
SOIC (D) | 16 |
2500 | LARGE T&R |
|
AM26LV32 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| AM26LV32CD |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
AM26LV32CD |
AM26LV32CD |
| AM26LV32CDE4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
AM26LV32CDE4 |
AM26LV32CDE4 |
| AM26LV32CDG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
AM26LV32CDG4 |
AM26LV32CDG4 |
| AM26LV32CDR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
AM26LV32CDR |
AM26LV32CDR |
| AM26LV32CDRE4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
AM26LV32CDRE4 |
AM26LV32CDRE4 |
| AM26LV32CDRG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
AM26LV32CDRG4 |
AM26LV32CDRG4 |
AM26LV32 应用技术支持与电子电路设计开发资源下载
- AM26LV32 数据资料 dataSheet 下载.PDF
- TI 德州仪器其它接口选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
AM26LV32 工具和软件