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STM32F103ZET6 512KB Flash,STM32 ARM核微控制器LQFP-144封装

STM32F103ZET6 参数
  1. ROM 32 K
  2. RAM 6 K
  3. 定时器 2x16-bit (8/8/8)
  4. 串口1xSPI/1xI2C/2xUSART* I/Os 32(32)
  5. 封装形式 LQFP48
  6. 适用电压2 to 3.6 V
Reference Root part number
STM32F103xC STM32F103RC,STM32F103VC,STM32F103ZC
STM32F103xD STM32F103RD,STM32F103VD,STM32F103ZD
STM32F103xE STM32F103RE,STM32F103ZE,STM32F103VE
STM32F103ZET6 订货型号:
Ordering Model Package RoHS Compliance Grade Marketing Status Pin Count Program Memory Type Internal ROM Size Internal RAM Size A/D Converter 12 or 16-bit timer (IC/OC/PWM) Other timer functions Serial Interface I/Os (High Current) Supply Voltage(Vcc) Supply Voltage(Vcc) Packing Type ESample Flag
nom nom nom min max
kB B V V
STM32F103ZEDIE1 UNSAWN WAFER V.I. 100% Not compliant Active 0 - 512 65536 21x12-bit 8x16-bit (24/24/28) 2 x WDG, RTC, 24-bit down counter, 2x16-bit Basic timers 3xSPI/2xI2S/2xI2C
/5xUSART/2xUART
/SDIO/USB/CAN
112(112) 2 3.6 - -
STM32F103ZEH6 LFBGA 10x10x1.7 144 F12x12 0.8 Ecopack2 Active 144 FLASH 512 65536 21x12-bit 8x16-bit (24/24/28) 2 x WDG, RTC, 24-bit down counter, 2x16-bit Basic timers 3xSPI/2xI2S/2xI2C
/5xUSART/2xUART
/SDIO/USB/CAN
112(112) 2 3.6 Tray No
STM32F103ZEH7 LFBGA 10x10x1.7 144 F12x12 0.8 Ecopack2 Active 144 - 512 65536 21x12-bit 8x16-bit (24/24/28) 2 x WDG, RTC, 24-bit down counter, 2x16-bit Basic timers 3xSPI/2xI2S/2xI2C
/5xUSART/2xUART
/SDIO/USB/CAN
112(112) 2 3.6 Tray -
STM32F103ZET6 LQFP 144 20X20X1.4 2 Ecopack2 Active 144 FLASH 512 65536 21x12-bit 8x16-bit (24/24/28) 2 x WDG, RTC, 24-bit down counter, 2x16-bit Basic timers 3xSPI/2xI2S/2xI2C
/5xUSART/2xUART
/SDIO/USB/CAN
112(112) 2 3.6 Tray No
STM32F103ZET7 LQFP 144 20X20X1.4 2 Ecopack2 Active 144 - 512 65536 21x12-bit 8x16-bit (24/24/28) 2 x WDG, RTC, 24-bit down counter, 2x16-bit Basic timers 3xSPI/2xI2S/2xI2C
/5xUSART/2xUART
/SDIO/USB/CAN
112(112) 2 3.6 Tray -
STM32F103ZET6 说明

The STM32F103xC, STM32F103xD and STM32F103xE performance line family incorporates the high-performance ARM? Cortex?-M3 32-bit RISC core operating at a 72 MHz frequency, high-speed embedded memories (Flash memory up to 512 Kbytes and SRAM up to 64 Kbytes), and an extensive range of enhanced I/Os and peripherals connected to two APB buses. All devices offer three 12-bit ADCs, four general purpose 16-bit timers plus two PWM timer, as well as standard and advanced communication interfaces:up to two I2Cs, three SPIs, two I2Ss, one SDIO, five USARTs, an USB and a CAN.

The STM32F103xx High-density performance line family operates in the ?40 to +105 °C temperature range, from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.The STM32F103xx High-density performance line family offers devices in 5 different package types: from 64 pins to 144 pins. Depending on the device chosen, different sets of peripherals are included, the description below gives an overview of the complete range of peripherals proposed in this family.These features make the STM32F103xx High-density performance line microcontroller family suitable for a wide range of applications:

STM32F103ZET6 特性:
STM32F103ZET6 技术支持与电子电路设计开发资源下载
  1. STM32F103ZE 数据手册DataSheet 下载.PDF
  2. 相关产品选型(Excel 文档格式选型 Excel 文档格式)
  3. STM32 选型指南
  4. 《技术手册》STM32技术参考手册部分章节.PDF
  5. 意法半导体应用支持 . PDF
  6. 先进半导体解决方案的门电子
  7. 电机控制参考指南
  8. 32位汽车微控制器底盘和安全应用
  9. 汽车的32位闪存微控制器汽车车身应用. PDF
  10. 汽车的32位闪存微控制器为群集应用程序. PDF
  11. 周围半导体机顶盒应用. PDF
  12. STM32开发工具. PDF
  13. STM32,STR7和STR9开发工具 . PDF
  14. 8 ,16和32位微控制器产品和工具选择指南. PDF
  15. 电机控制选型指南. PDF