M24C02-W 16K,8K,4K,2K,1K串行I2C总线的EEPROM

These I2C-compatible electrically erasable programmable memory (EEPROM) devices are organized as 2048/1024/512/256/128 x 8 (M24C16, M24C08, M24C04, M24C02 and M24C01).

In order to meet environmental requirements, ST offers these devices in ECOPACK? packages. ECOPACK? packages are Lead-free and RoHS compliant. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Reference	Generic Part Number
M24C16	M24C16-W
	M24C16-R
	M24C16-F
M24C08	M24C08-W
	M24C08-R
	M24C08-F
M24C04	M24C04-W
	M24C04-R
	M24C04-F
M24C02	M24C02-W
	M24C02-R
M24C01	M24C01-W
	M24C01-R

M24C02-W 订购型号:

Ordering Model	Storage Capacity	Serial Interface	Marketing Status	Automotive Grade	Supply Voltage(Vcc)	Supply Voltage(Vcc)	Clock Frequency(fSCL)	Package	ESample Flag
	spec				min	max	max
	kB				V	V	MHz
M24C02-WBN6P	2	I2C	Active	_	2.5	5.5	0.4	PDIP8	No
M24C02-WDW3TP/S	2	I2C	Active	Yes	2.5	5.5	0.4	TSSOP8	No
M24C02-WDW6TP	2	I2C	Active	_	2.5	5.5	0.4	TSSOP8	No
M24C02-WMN3TP/S	2	I2C	Active	Yes	2.5	5.5	0.4	SO8	No
M24C02-WMN6P	2	I2C	Active	_	2.5	5.5	0.4	SO8	No
M24C02-WMN6TP	2	I2C	Active	_	2.5	5.5	0.4	SO8	Yes

M24C02-W 特性:

• Two-wire I2C serial interface
  Supports 400 kHz protocol
• Single supply voltage:
  – 2.5 V to 5.5 V for M24Cxx-W
  – 1.8 V to 5.5 V for M24Cxx-R
  – 1.7 V to 5.5 V for M24Cxx-F
• Write Control input
• Byte and Page Write (up to 16 bytes)
• Random and Sequential Read modes
• Self-timed programming cycle
• Automatic address incrementing
• Enhanced ESD/latch-up protection
• More than 1 million write cycles
• More than 40-year data retention
• Packages
  – ECOPACK? (RoHS compliant)

M24C02-W 技术支持与电子电路设计开发资源下载

1. M24C02-W 数据手册DataSheet下载.PDF
2. 相关产品选型( Excel 文档格式)
3. 串行EEPROM存储器选型指南
4. ST与其他品牌EEPROM选型对照表
5. 面向低压EEPROM的8引脚微型封装（MLP） 2x3（宣传册,PDF）
6. 串行EEPROM,工业标准级与专用存储器 （产品手册,PDF）
7. 串行EEPROM – 汽车应用的首选产品 （选择指南, PDF）
8. AN2014 - 应用笔记 - 一个设计者如何最好地利用ST串行EEPROM（应用笔记,PDF）
9. ST和竞争对手Atmel、Macronix、Holtek、Oki、Winbond的对照 (产品彩页, PDF)
10. RFID和射频内存产品 . PDF
11. 提升灵活性与world'sn ° 1 EEPROM的供应商. PDF
12. 意法半导体应用支持. PDF
13. 汽车级半导体器件. PDF
14. 周围半导体机顶盒应用. PDF