The MAX2361 dual-band, triple-mode complete transmitter for cellular phones represents an integrated and architecturally advanced solution for this application. The device takes a differential I/Q baseband input and converts it up to IF through a quadrature modulator and IF variable-gain amplifier (VGA). The signal is then routed to an external bandpass filter and upconverted to RF through an image-reject mixer and RF VGA. The signal is further amplified with an on-chip PA driver. An IF synthesizer, an RF synthesizer, a local oscillator (LO) buffer, and a 3-wire programmable bus complete the basic functional blocks of this IC. The MAX2363 supports single-band, single- mode (PCS) operation. The MAX2365 supports single- band cellular dual-mode operation.
The MAX2361 enables architectural flexibility because of its two IF voltage-controlled oscillators (VCOs), two IF ports, two RF LO input ports, and three PA driver output ports. The devices allow the use of a single receive IF frequency and split-band PCS filters for optimum out-ofband noise performance. The low-noise PA drivers allow up to three RF SAW filters to be eliminated. Select a mode of operation by loading data on the SPITM/QSPITM/MICROWIRETM-compatible 3-wire serial bus. Charge-pump current, IF/RF gain balancing, standby, shutdown plus additional functions, are also controlled with the serial interface.
The MAX2361/MAX2363/MAX2365 come in a 48-pin TQFN-EP and QFN-EP package and are specified for the extended (-40°C to +85°C) temperature range.
关键特性
应用/使用
Key Specifications: Transmit System ICs | ||||||||||
Part Number | Solutions | Applications | Features | Footprint (mm x mm) | Min. Foot- print (mm2) |
RoHS Available | ||||
MAX2361 | Cellular | AMPS CDMA TDMA WCDMA |
+9dBm Linear Output Power 100dB Power Control Range QSPI/SPI/MICROWIRE-Compatible 3-Wire Bus Supply Current Drops as Output Power Decreases |
7.0 x 7.0 | 50 | Yes | ||||
MAX2363 | CDMA TDMA WCDMA |
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MAX2365 | AMPS CDMA TDMA |
MAX2361 |
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温度 | RoHS/无铅? | ||||
MAX2361EGM-D | QFN;48引脚;50mm^2 封装图: 21-0092H (PDF) 使用封装码/变更:G4877-1* |
-40°C至+85°C | RoHS/无铅:否 | ||||
MAX2361EGM-TD | QFN;48引脚;50mm^2 封装图: 21-0092H (PDF) 使用封装码/变更:G4877-1* |
-40°C至+85°C | RoHS/无铅:否 | ||||
MAX2361ETM+T | THIN QFN;48引脚;50mm^2 封装图: 21-0144F (PDF) 使用封装码/变更:T4877+3* |
-40°C至+85°C | RoHS/无铅:无铅 | ||||
MAX2361ETM+ | THIN QFN;48引脚;50mm^2 封装图: 21-0144F (PDF) 使用封装码/变更:T4877+3* |
-40°C至+85°C | RoHS/无铅:无铅 | ||||
MAX2361ETM-B4A | THIN QFN;48引脚;50mm^2 封装图: 21-0144F (PDF) 使用封装码/变更:T4877-3* |
-40°C至+85°C | RoHS/无铅:否 | ||||
MAX2363 |
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温度 | RoHS/无铅? | ||||
MAX2363EVKIT | RoHS/无铅:参考数据资料 | ||||||
MAX2363EGM-TD | QFN;48引脚;50mm^2 封装图: 21-0092H (PDF) 使用封装码/变更:G4877-1* |
-40°C至+85°C | RoHS/无铅:否 | ||||
MAX2363EGM-D | QFN;48引脚;50mm^2 封装图: 21-0092H (PDF) 使用封装码/变更:G4877-1* |
-40°C至+85°C | RoHS/无铅:否 | ||||
MAX2363ETM+ | THIN QFN;48引脚;50mm^2 封装图: 21-0144F (PDF) 使用封装码/变更:T4877+3* |
-40°C至+85°C | RoHS/无铅:无铅 | ||||
MAX2363ETM+T | THIN QFN;48引脚;50mm^2 封装图: 21-0144F (PDF) 使用封装码/变更:T4877+3* |
-40°C至+85°C | RoHS/无铅:无铅 | ||||
MAX2365 |
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温度 | RoHS/无铅? 材料分析 |
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MAX2365EGM-D | QFN;48引脚;50mm^2 封装图: 21-0092H (PDF) 使用封装码/变更:G4877-1* |
-40°C至+85°C | RoHS/无铅:否 | ||||
MAX2365EGM-TD | QFN;48引脚;50mm^2 封装图: 21-0092H (PDF) 使用封装码/变更:G4877-1* |
-40°C至+85°C | RoHS/无铅:否 | ||||
MAX2365ETM+ | THIN QFN;48引脚;50mm^2 封装图: 21-0144F (PDF) 使用封装码/变更:T4877+3* |
-40°C至+85°C | RoHS/无铅:无铅 | ||||
我们 怎么炒货的,尤其是那几个系列的ETM+T | THIN QFN;48引脚;50mm^2 封装图: 21-0144F (PDF) 使用封装码/变更:T4877+3* |
-40°C至+85°C | RoHS/无铅:无铅 |
MAX2363 技术支持