The HC5503PRC is a low cost SLIC optimized for large Telecom switches. It combines a flexible voltage feed architecture with the Intersil latch-free DI bonded wafer process, to provide a low component count, carrier class solution at very low cost. The re-configurable design permits simple, economical solutions for campus-wide call center and PBX applications. External components can be used in conjunction with the high battery voltage capability to meet the complex impedance and long loop drive requirements of Central Office switches, worldwide.
芯片型号 | 产品状态 | 温度范围 | 封装尺寸图 | 潮湿敏感度等级MSL | 美元价格US $ |
HC5503PRCB | 量产 | 民用级 | 24 Ld SOIC | 1 | 2.27 |
HC5503PRCB96 | 量产 | 民用级 | 24 Ld SOIC T+R | 1 | 2.33 |
HC5503PRCBZ | 量产 | 民用级 | 24 Ld SOIC | 3 | 2.27 |
HC5503PRCBZ96 | 量产 | 民用级 | 24 Ld SOIC T+R | 3 | 2.33 |
HC5503PRCR | 量产 | 民用级 | 32 Ld QFN | 2 | 2.39 |
HC5503PRCR96 | 量产 | 民用级 | 32 Ld QFN T+R | 2 | 2.39 |
HC5503PRCRZ | 量产 | 民用级 | 32 Ld QFN | 3 | 2.39 |
HC5503PRCRZ96 | 量产 | 民用级 | 32 Ld QFN T+R | 3 | 2.39 |