SN74AVC16373 具有三态输出的 16 位透明 D 类锁存器
              A Dynamic Output Control (DOCTM) circuit is implemented, which, during the   transition, initially lowers the output impedance to effectively drive the load   and, subsequently, raises the impedance to reduce noise. Figure 1 shows typical   VOL vs IOL and VOH vs IOH curves to   illustrate the output impedance and drive capability of the circuit. At the   beginning of the signal transition, the DOC circuit provides a maximum dynamic   drive that is equivalent to a high-drive standard-output device. For more   information, refer to the TI application reports, AVC Logic Family   Technology and Applications, literature number SCEA006, and Dynamic   Output Control (DOCTM) Circuitry Technology and Applications, literature   number SCEA009.
              SN74AVC16373 特性
              
              
                - Member of the Texas Instruments WidebusTM Family   
                
 - EPICTM (Enhanced-Performance Implanted CMOS) Submicron Process   
                
 - DOCTM (Dynamic Output Control) Circuit Dynamically Changes Output Impedance,   Resulting in Noise Reduction Without Speed Degradation   
                
 - Dynamic Drive Capability Is Equivalent to Standard Outputs With   IOH and IOL of ±24 mA at 2.5-V VCC   
                
 - Overvoltage-Tolerant Inputs/Outputs Allow Mixed-Voltage-Mode Data   Communications   
                
 - Ioff Supports Partial-Power-Down Mode Operation   
                
 - ESD Protection Exceeds JESD 22
                  
                      - 2000-V Human-Body Model (A114-A)   
                      
 - 200-V Machine Model (A115-A)
 
                  
                 - Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II   
                
 - Package Options Include Plastic Thin Shrink Small-Outline (DGG) and Thin   Very Small-Outline (DGV) Packages
 
              
              SN74AVC16373 芯片订购指南
              
                
                  | 器件 | 
                  状态 | 
                  温度 | 
                  价格(美元) | 
                  封装 | 引脚 | 
                  封装数量 | 封装载体 | 
                  丝印标记 | 
                
                
                  | SN74AVC16373DGGR | 
                  ACTIVE | 
                  -40 to 85 | 
                  1.90 | 1ku | 
                  TSSOP (DGG) | 48 | 
                  2000 | LARGE T&R | 
                    | 
                
                
                  | SN74AVC16373DGVR | 
                  ACTIVE | 
                  -40 to 85 | 
                  1.90 | 1ku | 
                  TVSOP (DGV) | 48 | 
                  2000 | LARGE T&R | 
                    | 
                
              
              SN74AVC16373 质量与无铅数据
              
                
                  | 器件 | 
                  环保计划* | 
                  铅/焊球涂层 | 
                  MSL 等级/回流焊峰 | 
                  环保信息与无铅 (Pb-free) | 
                  DPPM / MTBF / FIT 率 | 
                
                
                  | SN74AVC16373DGGR | 
                  Green (RoHS & no Sb/Br)  | 
                  CU NIPDAU  | 
                  Level-1-260C-UNLIM | 
                  SN74AVC16373DGGR | 
                  SN74AVC16373DGGR | 
                
                
                  | SN74AVC16373DGVR | 
                  Green (RoHS & no Sb/Br)  | 
                  CU NIPDAU  | 
                  Level-1-260C-UNLIM | 
                  SN74AVC16373DGVR | 
                  SN74AVC16373DGVR | 
                
              
              SN74AVC16373 应用技术支持与电子电路设计开发资源下载
              
                - SN74AVC16373 数据资料   dataSheet 下载.PDF 
 
                - TI 德州仪器触发器/锁存器/寄存器产品选型与价格 . xls 
 
                - Shelf-Life Evaluation of Lead-Free Component Finishes  (PDF  1305 KB)
 
                - Understanding and Interpreting Standard-Logic Data Sheets  (PDF  857 KB)
 
                - TI IBIS File Creation, Validation, and Distribution Processes  (PDF  380 KB)
 
                - Implications of Slow or Floating CMOS Inputs  (PDF  101 KB)
 
                - CMOS Power Consumption and CPD Calculation  (PDF  89 KB)
 
                - Designing With Logic  (PDF  186 KB)
 
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                - Input and Output Characteristics of Digital Integrated Circuits  (PDF  1708 KB)
 
                - Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc  (PDF  43 KB) 
 
                - HiRel Unitrode Power Management Brochure  (PDF  206 KB)
 
                - LOGIC Pocket Data Book  (PDF  6001 KB)
 
                - HiRel Unitrode Power Management Brochure  (PDF  206 KB)
 
                - Logic Cross-Reference (PDF  2938 KB)