SN74ALVTH16827 具有三态输出的 2.5V/3.3V 20 位缓冲器/驱动器
SN74ALVTH16827 描述
The 'ALVTH16827 devices are 20-bit buffers/line drivers designed for 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.
The devices are composed of two 10-bit sections with separate output-enable signals. For either 10-bit buffer section, the two output-enable (1OE1\ and 1OE2\, or 2OE1\ and 2OE2\) inputs must be low for the corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 10-bit buffer section are in the high-impedance state.
When VCC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
|
SN74ALVTH16827 |
| Voltage Nodes(V) |
3.3, 2.5 |
| Vcc range(V) |
2.3 to 3.6 |
| Logic |
True |
| Input Level |
TTL/CMOS |
| Output Level |
LVTTL |
| Output Drive(mA) |
-8/24 |
| No. of Outputs |
16 |
| tpd max(ns) |
3 |
| Static Current |
5 |
| Rating |
Catalog |
| Technology Family |
ALVTLVT |
SN74ALVTH16827 特性
- State-of-the-Art Advanced BiCMOS Technology (ABT) WidebusTM Design for 2.5-V and 3.3-V Operation and Low Static Power Dissipation
- Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V VCC)
- Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
- High Drive (-24/24 mA at 2.5-V and -32/64 mA at 3.3-V VCC)
- Power Off Disables Outputs, Permitting Live Insertion
- High-Impedance State During Power Up and Power Down Prevents Driver Conflict
- Uses Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
- Auto3-State Eliminates Bus Current Loading When Output Exceeds VCC + 0.5 V
- Latch-Up Performance Exceeds 250 mA Per JESD 17
- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model; and Exceeds 1000 V Using Charged-Device Model, Robotic Method
- Flow-Through Architecture Facilitates Printed Circuit Board Layout
- Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
- Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Package
SN74ALVTH16827 芯片订购指南
| 器件 |
状态 |
温度 |
价格（美元） |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| SN74ALVTH16827DL |
ACTIVE |
-40 to 85 |
1.40 | 1ku |
SSOP (DL) | 56 |
25 | TUBE |
ALVTH162827 |
| SN74ALVTH16827LR |
ACTIVE |
-40 to 85 |
1.20 | 1ku |
SSOP (DL) | 56 |
1000 | LARGE T&R |
ALVTH162827 |
SN74ALVTH16827 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| SN74ALVTH16827DL |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74ALVTH16827DL |
SN74ALVTH16827DL |
| SN74ALVTH16827LR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74ALVTH16827LR |
SN74ALVTH16827LR |
SN74ALVTH16827 应用技术支持与电子电路设计开发资源下载
- SN74ALVTH16827 数据资料 dataSheet 下载.PDF
- TI 德州仪器缓冲器、驱动器/收发器产品选型与价格 . xls
- CMOS 非缓冲反向器在振荡器电路中的使用 (PDF 951 KB)
- Semiconductor Packing Methodology (PDF 3005 KB)
- 逻辑产品选择指南 2006/2007 （修订版 Z）(4462KB)
- 标准线性和逻辑产品 5 分钟指南 (786KB)
- 了解和解释标准逻辑数据表
- LOGIC Pocket Data Book (PDF 6001 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- Logic Cross-Reference (PDF 2938 KB)