TS5A3157 10Ω SPDT 模拟开关

	TS5A3157
Configuration	1 X SPDT
ron(max)(ohms)	10
IL OFF(Max)(nA)	N/A
OFF Time(Max)(ns)	6.5
ON Time(Max)(ns)	8.5
Operating Temperature Range(°C)	-40 to 85
Pin/Package	6DSBGA, 6SC70, 6SOT-23
Approx. Price (US$)	0.16 | 1ku
VCC(Min)(V)	5.5
Voltage Nodes(V)	1.8, 2.5, 3.0, 3.3, 5.0
RON Flatness(Max)(Ohms)	5
Technology Family	TS
ESD Rating(kV)	2kV HBM
Bandwidth(MHz)	300
Charge Injection(Max)(pC)	7
RON Mis-match(Max)(Ohms)	0.2
Voltage Node(V)	1.8, 2.5, 3.0, 3.3, 5.0
Vcc max(V)	5.5
Vcc min(V)	1.65
Number of Channels	1
Vcc range(V)	1.65 to 5.5
ICC(uA)	0.05
Rating	Catalog

TS5A3157 芯片订购指南

器件	状态	温度	价格	封装 | 引脚	封装数量 | 封装载体	丝印标记
TS5A3157DBVR	ACTIVE	-40 to 85	0.16 | 1ku	SOT-23 (DBV) | 6	3000 | LARGE T&R
TS5A3157DBVRE4	ACTIVE	-40 to 85	0.16 | 1ku	SOT-23 (DBV) | 6	3000 | LARGE T&R
TS5A3157DBVRG4	ACTIVE	-40 to 85	0.16 | 1ku	SOT-23 (DBV) | 6	3000 | LARGE T&R
TS5A3157DCKR	ACTIVE	-40 to 85	0.16 | 1ku	SC70 (DCK) | 6	3000 | LARGE T&R
TS5A3157DCKRE4	ACTIVE	-40 to 85	0.16 | 1ku	SC70 (DCK) | 6	3000 | LARGE T&R
TS5A3157DCKRG4	ACTIVE	-40 to 85	0.16 | 1ku	SC70 (DCK) | 6	3000 | LARGE T&R
TS5A3157YZPR	ACTIVE	-40 to 85	0.22 | 1ku	DSBGA (YZP) | 6	3000 | LARGE T&R

TS5A3157 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
TS5A3157DBVR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	TS5A3157DBVR	TS5A3157DBVR
TS5A3157DBVRE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	TS5A3157DBVRE4	TS5A3157DBVRE4
TS5A3157DBVRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	TS5A3157DBVRG4	TS5A3157DBVRG4
TS5A3157DCKR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	TS5A3157DCKR	TS5A3157DCKR
TS5A3157DCKRE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	TS5A3157DCKRE4	TS5A3157DCKRE4
TS5A3157DCKRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	TS5A3157DCKRG4	TS5A3157DCKRG4
TS5A3157YZPR	Green (RoHS & no Sb/Br)	SNAGCU	Level-1-260C-UNLIM	TS5A3157YZPR	TS5A3157YZPR

TS5A3157 应用技术支持与电子电路设计开发资源下载

1. TS5A3157 数据资料 dataSheet 下载.PDF
2. TI 德州仪器信号开关产品选型与价格 . xls
3. Logic Guide 2009 (PDF 4263 KB)
4. 防止模拟开关的额外功耗 (PDF 392 KB) (PDF 1305 KB)
5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
9. Designing With Logic (PDF 186 KB)
10. Live Insertion (PDF 150 KB)
11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
14. LOGIC Pocket Data Book (PDF 6001 KB)
15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
16. Logic Cross-Reference (PDF 2938 KB)