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TLV5638 12 位、1 或 3.5us DAC,具有串行输入、双路 DAC、可编程内部参考和稳定时间、功耗

TLV5638同类产品
TLV5616 TLV5618A TLV5636 TLV5638
Resolution(Bits) 12 12 12 12
DAC: Channels 1 2 1 2
Settling Time(us) 3 2.5 1 1
Sample / Update Rate(MSPS) 0.102 0.093 0.233 0.233
Interface Serial SPI Serial SPI Serial SPI Serial SPI
Output Type Voltage Voltage Voltage Voltage
Output Range Min.(V or mA) 0 0 0 0
Output Range Max.(V or mA) 5.1 5.1 5.1 5.1
Single/Dual Analog Supply + + + +
DNL(Max)(+/-LSB) 1 1 1 1
INL(Max)(+/-LSB) 4 4 4 4
INL (+/-)(Max)(%) 0.1 0.1 0.1 0.1
Monotonicity 12 12 12 12
SNR(Typ)(dB) 74 76 75 74
SFDR(Typ)(dB) 70 72 79 72
Power Consumption(Typ)(mW) 0.9 1.8 4.5 4.5
Architecture String String String String
Reference: Type Ext Ext Int/Ext Int/Ext
Analog Voltage AV/DD(Min)(V) 2.7 2.7 2.7 2.7
Analog Voltage AV/DD(Max)(V) 5.5 5.5 5.25 5.25
Logic Voltage DV/DD(Min)(V) 2.7 2.7 2.7 2.7
Logic Voltage DV/DD(Max)(V) 5.5 5.5 5.25 5.25
No. of Supplies (Unipolar) 1 1 1 1
Rating Catalog Catalog Catalog Catalog
Pin/Package 8MSOP, 8PDIP, 8SOIC 8PDIP, 8SOIC 8MSOP, 8SOIC 8SOIC
Approx. Price (US$) 3.30 | 1ku 5.10 | 1ku 4.55 | 1ku 4.65 | 1ku
Thermal Shutdown No No No No
Operating Temperature Range(°C) -40 to 85,0 to 70 -40 to 125,-40 to 85,0 to 70 -40 to 85,0 to 70 -40 to 125,-40 to 85,0 to 70
TLV5638 说明

The TLV5638 is a dual 12-bit voltage output DAC with a flexible 3-wire serial interface. The serial interface allows glueless interface to TMS320 and SPITM, QSPITM, and MicrowireTM serial ports. It is programmed with a 16-bit serial string containing 4 control and 12 data bits.

The resistor string output voltage is buffered by a x2 gain rail-to-rail output buffer. The buffer features a Class AB output stage to improve stability and reduce settling time. The programmable settling time of the DAC allows the designer to optimize speed vs power dissipation. With its on-chip programmable precision voltage reference, the TLV5638 simplifies overall system design.

Because of its ability to source up to 1 mA, the reference can also be used as a system reference.

TLV5638 特性
TLV5638 芯片订购指南
器件 状态 温度 (oC) 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
TLV5638CD ACTIVE 0 to 70 5.15 | 1ku SOIC (D) | 8 75 | TUBE 5638C
TLV5638CDG4 ACTIVE 0 to 70 5.15 | 1ku SOIC (D) | 8 75 | TUBE 5638C
TLV5638CDR ACTIVE 0 to 70 4.65 | 1ku SOIC (D) | 8 2500 | LARGE T&R 5638C
TLV5638CDRG4 ACTIVE 0 to 70 4.65 | 1ku SOIC (D) | 8 2500 | LARGE T&R 5638C
TLV5638ID ACTIVE -40 to 85 5.50 | 1ku SOIC (D) | 8 75 | TUBE 5638I
TLV5638IDG4 ACTIVE -40 to 85 5.50 | 1ku SOIC (D) | 8 75 | TUBE 5638I
TLV5638IDR ACTIVE -40 to 85 5.00 | 1ku SOIC (D) | 8 2500 | LARGE T&R 5638I
TLV5638IDRG4 ACTIVE -40 to 85 5.00 | 1ku SOIC (D) | 8 2500 | LARGE T&R 5638I
TLV5638QD ACTIVE -40 to 125 5.75 | 1ku SOIC (D) | 8 75 V5638
TLV5638QDG4 ACTIVE 5.75 | 1ku SOIC (D) | 8 75 V5638
TLV5638QDR ACTIVE -40 to 125 5.75 | 1ku SOIC (D) | 8 2500 V5638
TLV5638QDRG4 ACTIVE 5.75 | 1ku SOIC (D) | 8 2500 V5638
TLV5638 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TLV5638CD Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM   TLV5638CD
TLV5638CDG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV5638CDG4 TLV5638CDG4
TLV5638CDR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM   TLV5638CDR
TLV5638CDRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV5638CDRG4 TLV5638CDRG4
TLV5638ID Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM   TLV5638ID
TLV5638IDG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV5638IDG4 TLV5638IDG4
TLV5638IDR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM   TLV5638IDR
TLV5638IDRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV5638IDRG4 TLV5638IDRG4
TLV5638QD TBD CU NIPDAU Level-1-220C-UNLIM   TLV5638QD
TLV5638QDG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV5638QDG4 TLV5638QDG4
TLV5638QDR TBD CU NIPDAU Level-1-220C-UNLIM   TLV5638QDR
TLV5638QDRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV5638QDRG4 TLV5638QDRG4
TLV5638 应用技术支持与电子电路设计开发资源下载
  1. TLV5638 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器仪DAC 模数转换器产品选型与价格 . xls
  3. 模数规格和性能特性术语表 (Rev. A) (PDF 1993 KB)
  4. 所选封装材料的热学和电学性质 (PDF 645 KB)
  5. 高速数据转换 (PDF 1967 KB)
  6. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  7. Analog-to-Digital Converter Grounding Practices Affect System Performance (PDF 56 KB)
  8. Principles of Data Acquisition and Conversion (PDF 50 KB)
  9. Interleaving Analog-to-Digital Converters (PDF 64 KB)
  10. What Designers Should Know About Data Converter Drift (PDF 95 KB)
  11. Giving Delta-Sigma Converters a Gain Boost with a Front End Analog Gain Stage (PDF 70 KB)
  12. Programming Tricks for Higher Conversion Speeds Utilizing Delta Sigma Converters (PDF 105 KB)
TLV5638 工具与软件
名称 型号 公司 工具/软件类型
针对 Code Composer Studio 的 DCPFREETOOL 软件插件 DCPFREETOOL Texas Instruments 实用程序/插件
MDACBufferPro Design Utility for Multiplying Digital to Analog Converter Design MDACBUFFERPRO Texas Instruments 应用软件