首页 > TI 德州仪器 > 数模转换器

TLV5629 8 位 8 通道 1/3 us DAC,具有串行 输入、可编程建立时间/功耗、低功耗和电源关闭功能

TLV5629 同类产品

TLV5629
Resolution(Bits) 8
DAC: Channels 8
Settling Time(us) 1
Sample / Update Rate(MSPS) 0.283
Interface Serial SPI
Output Type Voltage
Output Range Min.(V or mA) 0
Output Range Max.(V or mA) 5.1
Single/Dual Analog Supply +
DNL(Max)(+/-LSB) 1
INL(Max)(+/-LSB) 1
INL (+/-)(Max)(%) 0.4
Monotonicity 8
Power Consumption(Typ)(mW) 18
Architecture String
Reference: Type Ext
Analog Voltage AV/DD(Min)(V) 2.7
Analog Voltage AV/DD(Max)(V) 5.5
Logic Voltage DV/DD(Min)(V) 2.7
Logic Voltage DV/DD(Max)(V) 5.5
No. of Supplies (Unipolar) 1
Rating Catalog
Pin/Package 20SOIC, 20TSSOP
Approx. Price (US$) 3.15 | 1ku
Thermal Shutdown No
Operating Temperature Range(°C) -40 to 85
TLV5629 说明

The TLV5610, TLV5608, and TLV5629 are pin-compatible,eight-channel, 12-/10-/8-bit voltage output DACs each with a flexible serial interface. The serial interface allows glueless interface to TMS320 and SPI, QSPI, and Microwire serial ports. It is programmed with a 16-bit serial string containing 4 control and 12 data bits.

Additional features are a power-down mode, an LDAC input for simultaneous update of all eight DAC outputs, and a data output which can be used to cascade multiple devices.

The resistor string output voltage is buffered by a rail-to-rail output amplifier with a programmable settling time to allow the designer to optimize speed vs power dissipation. The buffered, high-impedance reference input can be connected to the supply voltage.

TLV5629 特性
TLV5629 芯片订购指南
器件 状态 温度 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
TLV5629IDW ACTIVE -40 to 85 3.50 | 1ku SOIC (DW) | 20 25 | TUBE TLV5629I
TLV5629IDWG4 ACTIVE -40 to 85 3.50 | 1ku SOIC (DW) | 20 25 | TUBE TLV5629I
TLV5629IDWR ACTIVE -40 to 85 3.15 | 1ku SOIC (DW) | 20 2000 | LARGE T&R TLV5629I
TLV5629IDWRG4 ACTIVE -40 to 85 3.15 | 1ku SOIC (DW) | 20 2000 | LARGE T&R TLV5629I
TLV5629IPW ACTIVE -40 to 85 3.50 | 1ku TSSOP (PW) | 20 70 | TUBE TY5632
TLV5629IPWG4 ACTIVE -40 to 85 3.50 | 1ku TSSOP (PW) | 20 70 | TUBE TY5632
TLV5629IPWR ACTIVE -40 to 85 3.15 | 1ku TSSOP (PW) | 20 2000 | LARGE T&R TY5632
TLV5629IPWRG4 ACTIVE -40 to 85 3.15 | 1ku TSSOP (PW) | 20 2000 | LARGE T&R TY5632
TLV5629 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TLV5629IDW Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM   TLV5629IDW
TLV5629IDWG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV5629IDWG4 TLV5629IDWG4
TLV5629IDWR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM   TLV5629IDWR
TLV5629IDWRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV5629IDWRG4 TLV5629IDWRG4
TLV5629IPW Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM   TLV5629IPW
TLV5629IPWG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV5629IPWG4 TLV5629IPWG4
TLV5629IPWR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM   TLV5629IPWR
TLV5629IPWRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV5629IPWRG4 TLV5629IPWRG4
TLV5629 应用技术支持与电子电路设计开发资源下载
  1. TLV5629 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器仪DAC 模数转换器产品选型与价格 . xls
  3. 模数规格和性能特性术语表 (Rev. A) (PDF 1993 KB)
  4. 所选封装材料的热学和电学性质 (PDF 645 KB)
  5. 高速数据转换 (PDF 1967 KB)
  6. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  7. Analog-to-Digital Converter Grounding Practices Affect System Performance (PDF 56 KB)
  8. Principles of Data Acquisition and Conversion (PDF 50 KB)
  9. Interleaving Analog-to-Digital Converters (PDF 64 KB)
  10. What Designers Should Know About Data Converter Drift (PDF 95 KB)
  11. Giving Delta-Sigma Converters a Gain Boost with a Front End Analog Gain Stage (PDF 70 KB)
  12. Programming Tricks for Higher Conversion Speeds Utilizing Delta Sigma Converters (PDF 105 KB)
TLV5629 工具与软件
名称 型号 公司 工具/软件类型
TLV5629 评估模块 TLV5629EVM Texas Instruments 开发电路板/EVM
针对 Code Composer Studio 的 DCPFREETOOL 软件插件 DCPFREETOOL Texas Instruments 实用程序/插件
MDACBufferPro Design Utility for Multiplying Digital to Analog Converter Design MDACBUFFERPRO Texas Instruments 应用软件