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TLV5619 12 位单通道并行 DAC，具有电压输出、低功耗和异步更新

TLV5619 同类产品
TLV5619 说明

The TLV5619 is a 12-bit voltage output DAC with a microprocessor and TMS320 compatible parallel interface. The 12 data bits are double buffered so that the output can be updated asynchronously using the LDAC\ pin. During normal operation, the device dissipates 8 mW at a 5-V supply and 4.3 mW at a 3-V supply. The power consumption can be lowered to 50 nW by setting the DAC to power-down mode.

The output voltage is buffered by a ×2 gain rail-to-rail amplifier, which features a Class A output stage to improve stability and reduce settling time.

DAC7621 TLV5619 TLV5633 TLV5639
Resolution(Bits) 12 12 12 12
DAC: Channels 1 1 1 1
Settling Time(us) 10 1 1 1
Sample / Update Rate(MSPS) 0.143 1 0.286 0.286
Interface Parallel Parallel Parallel Parallel
Output Type Voltage Voltage Voltage Voltage
Output Range Min.(V or mA) -2.5 0 0 0
Output Range Max.(V or mA) 2.5 5.1 5.1 5.1
Single/Dual Analog Supply + + + +
DNL(Max)(+/-LSB) 1 1 0.5 0.5
INL(Max)(+/-LSB) 1 4 3 3
INL (+/-)(Max)(%) 0.024 0.1 0.07 0.07
Monotonicity 12 12 12 12
SNR(Typ)(dB) 78 78 78
SFDR(Typ)(dB) 72 74 74
Power Consumption(Typ)(mW) 2.5 4.3 2.7 2.7
Architecture R-2R String String String
Reference: Type Int/Ext Ext Int/Ext Int/Ext
Analog Voltage AV/DD(Min)(V) 4.75 2.7 2.7 2.7
Analog Voltage AV/DD(Max)(V) 5.25 5.5 5.5 5.25
Logic Voltage DV/DD(Min)(V) 4.75 2.7 2.7 2.7
Logic Voltage DV/DD(Max)(V) 5.25 5.5 5.5 5.25
No. of Supplies (Unipolar) 1 1 1 1
Rating Catalog Catalog Catalog Catalog
Pin/Package 20SSOP 20SOIC, 20TSSOP 20SOIC, 20TSSOP 20SOIC, 20TSSOP
Approx. Price (US$) 2.75 | 1ku 4.10 | 1ku 5.90 | 1ku 4.35 | 1ku
Thermal Shutdown No No No No
Operating Temperature Range(°C) -40 to 85 -40 to 85,-40 to 125,0 to 70 -40 to 85,0 to 70 -40 to 85,0 to 70
TLV5619 特性
TLV5619 芯片订购指南
器件 状态 温度 (oC) 价格（美元） 封装 | 引脚 封装数量 | 封装载体 丝印标记
TLV5619CDW ACTIVE 0 to 70 4.55 | 1ku SOIC (DW) | 20 25 | TUBE TLV5619C
TLV5619CDWG4 ACTIVE 0 to 70 4.55 | 1ku SOIC (DW) | 20 25 | TUBE TLV5619C
TLV5619CDWR ACTIVE 0 to 70 4.10 | 1ku SOIC (DW) | 20 2000 | LARGE T&R TLV5619C
TLV5619CDWRG4 ACTIVE 0 to 70 4.10 | 1ku SOIC (DW) | 20 2000 | LARGE T&R TLV5619C
TLV5619CPW ACTIVE 0 to 70 4.55 | 1ku TSSOP (PW) | 20 70 | TUBE TV5619
TLV5619CPWG4 ACTIVE 0 to 70 4.55 | 1ku TSSOP (PW) | 20 70 | TUBE TV5619
TLV5619CPWR ACTIVE 0 to 70 4.10 | 1ku TSSOP (PW) | 20 2000 | LARGE T&R TV5619
TLV5619CPWRG4 ACTIVE 0 to 70 4.10 | 1ku TSSOP (PW) | 20 2000 | LARGE T&R TV5619
TLV5619IDW ACTIVE -40 to 85 4.85 | 1ku SOIC (DW) | 20 25 | TUBE TLV5619I
TLV5619IDWG4 ACTIVE -40 to 85 4.85 | 1ku SOIC (DW) | 20 25 | TUBE TLV5619I
TLV5619IDWR ACTIVE -40 to 85 4.40 | 1ku SOIC (DW) | 20 2000 | LARGE T&R TLV5619I
TLV5619IDWRG4 ACTIVE -40 to 85 4.40 | 1ku SOIC (DW) | 20 2000 | LARGE T&R TLV5619I
TLV5619IPW ACTIVE -40 to 85 4.85 | 1ku TSSOP (PW) | 20 70 | TUBE TY5619
TLV5619IPWG4 ACTIVE -40 to 85 4.85 | 1ku TSSOP (PW) | 20 70 | TUBE TY5619
TLV5619IPWR ACTIVE -40 to 85 4.40 | 1ku TSSOP (PW) | 20 2000 | LARGE T&R TY5619
TLV5619IPWRG4 ACTIVE -40 to 85 4.40 | 1ku TSSOP (PW) | 20 2000 | LARGE T&R TY5619
TLV5619QDW ACTIVE -40 to 125 5.10 | 1ku SOIC (DW) | 20 25 TLV5619Q
TLV5619QDWG4 ACTIVE 5.10 | 1ku SOIC (DW) | 20 25 TLV5619Q
TLV5619QDWR ACTIVE -40 to 125 5.10 | 1ku SOIC (DW) | 20 2000 TLV5619Q
TLV5619QDWRG4 ACTIVE 5.10 | 1ku SOIC (DW) | 20 2000 TLV5619Q
TLV5619 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TLV5619CDW Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM   TLV5619CDW
TLV5619CDWG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV5619CDWG4 TLV5619CDWG4
TLV5619CDWR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM   TLV5619CDWR
TLV5619CDWRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV5619CDWRG4 TLV5619CDWRG4
TLV5619CPW Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM   TLV5619CPW
TLV5619CPWG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV5619CPWG4 TLV5619CPWG4
TLV5619CPWR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM   TLV5619CPWR
TLV5619CPWRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV5619CPWRG4 TLV5619CPWRG4
TLV5619IDW Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM   TLV5619IDW
TLV5619IDWG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV5619IDWG4 TLV5619IDWG4
TLV5619IDWR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM   TLV5619IDWR
TLV5619IDWRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV5619IDWRG4 TLV5619IDWRG4
TLV5619IPW Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM   TLV5619IPW
TLV5619IPWG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV5619IPWG4 TLV5619IPWG4
TLV5619IPWR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM   TLV5619IPWR
TLV5619IPWRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV5619IPWRG4 TLV5619IPWRG4
TLV5619QDW TBD CU NIPDAU Level-1-220C-UNLIM   TLV5619QDW
TLV5619QDWG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV5619QDWG4 TLV5619QDWG4
TLV5619QDWR TBD CU NIPDAU Level-1-220C-UNLIM   TLV5619QDWR
TLV5619QDWRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TLV5619QDWRG4 TLV5619QDWRG4
TLV5619 应用技术支持与电子电路设计开发资源下载
  1. TLV5619 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器仪DAC 模数转换器产品选型与价格 . xls
  3. 模数规格和性能特性术语表 (Rev. A) (PDF 1993 KB)
  4. 所选封装材料的热学和电学性质 (PDF 645 KB)
  5. 高速数据转换 (PDF 1967 KB)
  6. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  7. Analog-to-Digital Converter Grounding Practices Affect System Performance (PDF 56 KB)
  8. Principles of Data Acquisition and Conversion (PDF 50 KB)
  9. Interleaving Analog-to-Digital Converters (PDF 64 KB)
  10. What Designers Should Know About Data Converter Drift (PDF 95 KB)
  11. Giving Delta-Sigma Converters a Gain Boost with a Front End Analog Gain Stage (PDF 70 KB)
  12. Programming Tricks for Higher Conversion Speeds Utilizing Delta Sigma Converters (PDF 105 KB)
TLV5619 工具与软件
名称 型号 公司 工具/软件类型
针对 Code Composer Studio 的 DCPFREETOOL 软件插件 DCPFREETOOL Texas Instruments 实用程序/插件
MDACBufferPro Design Utility for Multiplying Digital to Analog Converter Design MDACBUFFERPRO Texas Instruments 应用软件