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TLK1101E 11.3Gb/s 电缆和 PC 主板均衡器

The TLK1101E is a versatile and flexible high-speed equalizer for applications in digital high-speed links with data rates up to 11.3Gbps.

The TLK1101E can be configured in many ways to optimize its performance. It provides output de-emphasis adjustable from 0dB to 7dB using pins DE0 and DE1.

The output differential voltage swing can be set to 300mVp-p, 600mVp-p, or 900mVp-p using the SWG pin. A controlling voltage on pin VTH can be used to adjust the input threshold voltage.

Pins LN0 and LN1 can be used to optimize the device performance for various interconnect lengths, e.g. from 0 to 20 meters of 24-AWG twinaxial cable.

The LOS (loss of signal) assert level can be set to a desired level through a controlling voltage connected to pin LOSL

SN65LVCP202
Protocols 10GbE, 10GFC
Speed(Max)(Gbps) 11.3
Number of Channels 1
ICC(Max)(mA) 120
ESD HBM(kV) 2.5
Operating Temperature Range(°C) -40 to 100
Pin/Package 20QFN
Approx. Price (US$) 7.95 | 1ku
TLK1101E 特性
TLK1101E 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
TLK1101ERGPR ACTIVE -40 to 100 7.95 | 1ku QFN (RGP) | 20 3000 | LARGE T&R  
TLK1101ERGPRG4 ACTIVE -40 to 100 7.95 | 1ku QFN (RGP) | 20 3000 | LARGE T&R  
TLK1101ERGPT ACTIVE -40 to 100 9.15 | 1ku QFN (RGP) | 20 250 | SMALL T&R  
TLK1101ERGPTG4 ACTIVE -40 to 100 9.15 | 1ku QFN (RGP) | 20 250 | SMALL T&R  
TLK1101E 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TLK1101ERGPR Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLK1101ERGPR TLK1101ERGPR
TLK1101ERGPRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLK1101ERGPRG4 TLK1101ERGPRG4
TLK1101ERGPT Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLK1101ERGPT TLK1101ERGPT
TLK1101ERGPTG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLK1101ERGPTG4 TLK1101ERGPTG4
TLK1101E 应用技术支持与电子电路设计开发资源下载
  1. TLK1101E 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器均衡器和转接驱动器选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 接口选择指南 (Rev. D) (PDF 2994 KB)
  5. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  6. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  7. Isolated RS-485 Reference Design (PDF 80 KB)
  8. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  9. Analog Signal Chain Guide (8.62 MB)
  10. Industrial Interface IC Solutions (101 KB)