CSD25401Q3 | |
VDS(V) | -20 |
VGS(V) | -12 |
VGSTH(V) | 0.85 |
RDS(on) at VGS=4.5V(mOhm) | 8.7 |
QGD(nC) | 2.1 |
QGS(nC) | 2.1 |
QG(nC) | 8.8 |
Operating Temperature Range(°C) | -55 to 150 |
Pin/Package | 8SON |
The NexFET power MOSFET has been designed to minimize losses in power conversion load management applications. The SON 3×3 package offers excellent thermal performance for the size of the package.
器件 | 状态 | 温度 (oC) | 价格(美元) | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
CSD25401Q3 | ACTIVE | -55 to 150 | 0.36 | 1ku | DSBGA (DQG) | 8 | 3000 | LARGE T&R |
器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
CSD25401Q3 | Pb-Free (RoHS Exempt) | Call SN | Level-1-260C-UNLIM | CSD25401Q3 | CSD25401Q3 |